Producing printed circuits by using powder-embedded composition as etch-resist
Abstract
Abstract METHOD OF FORMING A PRINTED CIRCUIT WHICH COMPRISES THE STEPS OF EXPOSING AN INSULATING BOARD BEARING A CONDUCTIVE METAL SUBBING LAYER, SAID CONDUCTIVE METAL LAYER BEARING A LIGHT-SENSITIVE LAYER CAPABLE OF DEVELOPING A RD OF 1.0 TO 2.2 TO ACTINIC RADIATION TO PRODUCE A POTENTIAL RD OF 1.0 TO 2.2, DEVELOPING SAID LIGHT-SENSITIVE LAYER WITH WATER-INSOLUBLE POWDER PARTICLES USING PHYSICAL FORCE TO EMBED THE POWDER PARTICLES IN THE LIGHT-SENSITIVE LAYER, REMOVING NON-EMBEDDED POWDER PARTICLES FROM THE NONIMAGE AREAS, FUSING THE WATER-INSOLUBLE POWDER PARTICLES TO THE METAL SUBBING LAYER BY HEATING, AND ETCHING THE METAL LAYER IN THE AREAS UNPROTECTED BY THE FUSED WATERINSOLUBLE POWDER PARTICLES.
Inventors
- 👤 R Jones
- 👤 W Thompson
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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