Cosmetic composition containing microencapsulated solvents for nail enamel

Claim 1

A cosmetic composition for removing nail enamel comprising an aqueous phase adapted to be applied locally with cotton wad or cloth to the nail and containing a multiplicity of rupturable microcapsules, a portion of said microcapsules encapsulating a first solvent for said enamel, which otherwise has a disagreeable odor, evaporates excessively on storage and exhibits a moderate solvent action on said enamel, the remainder of said microcapsules encapsulting (1) a second solvent for said enamel which otherwise has a disagreeable odor, evaporates excessively on storage and exhibits a solvent action on said enamel greater than said first solvent and (2) a perfume effective to mask the otherwise disagreeable odor of said solvents, said portion of microcapsules containing said first solvent being readily ruptured by mechanical pressure so that the solvent action of said first solvent cannot occur until sufficient mechanical pressure has been exerted at the moment of application of said composition, said remainder of microcapsules containing said second solvent and perfume being ruptured by mechanical pressure greater than that necessary to rupture said portion of microcapsules containing said first solvent so that the solvent action of said second solvent and the masking action of said perfume occurs after release of said first solvent whereby release of said perfume indicates that said remainder of said microcapsules has been ruptured, the density of said microcapsules being substantially equal to the density of said aqueous phase to provide uniform distribution of said microcapsules in said composition, said walls of said microcapsules being inert to said solvents, said perfume and said aqueous phase and being formed of a material selected from the group consisting of polystyrene/maleic acid, polyethylene, polyethylene/ethyl cellulose mixture, polyurethane, polyester, gelatin, natural wax, paraffin wax, polyamide, urea formaldehyde, Acetal homopolymers and copolymers, casein, epoxy resin, polypropylene and cellulose acetophthalate.