US3728090A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor bonding alloy
Assignee: Texas Instruments Inc
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Filing: 1970-06-30
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Granted: 1973-04-17
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Expires: 1990-06-30
Abstract
Abstract A BONDING ALLOY FOR SEMICONDUCTORS AND THE LIKE COMPRISES ATERNARY ALLOY CONTAINING ALUMINUM, GERMANIUM AND ZINC. THE PREFERRED EMBODIMENT OF THE INVENTION COMPRISES THE ALUMINUM-GERMANIUM-ZINC TERNARY EUTECTIC ALLOY WHICH MELTS AT 370*C. AND WHICH INCLUDES 20 WT. PERCENT ALUMINUM, 23 WT. PERCENT GERMANIUM AND 57 WT. PERCENT ZINC. IN THE USE OF THE INVENTION, A QUATITY OF ALUMINUM-GERMANIUM-ZINC ALLOY MATERIAL IS POSITIONED BETWEEN A SEMICONDUCTOR DEVICE AND A DEVICE RECEIVING MEMBER. THE RESULTING ASSEMBLY IS THEN HEATED TO ABOVE THE MELTING TEMPERATURE OF THE ALLOY MATERIAL, WHEREUPON THE ALLOY MATERIAL BONDS THE SEMICONDUCTOR DEVICE TO THE DEVICE RECEIVING MEMBER.
Inventors
- 👤 J Hoffman
- 👤 D Manus
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 12:19
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/30; H10W72/07331; H10W72/07336; H10W72/07351; H10W72/07355; H10W72/351; H10W72/352; H10W72/3524; H10W72/50; H10W72/59; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528; Y10T428/12674; Y10T428/12736; Y10T428/12771; Y10T428/12785; Y10T428/12792
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-04-16 | 1976-10-16 | 1977-04-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-04-16 | 1980-10-16 | 1981-04-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-04-16 | 1984-10-16 | 1985-04-17 | $7700.00 | Window Closed / Lapsed |