Nickel plating baths containing aromatic sulfonic acids

Abstract

Abstract THE STRESS OF NICKEL DEPOSITS FROM PLATING SOLUTIONS CAN BE ALTERED FROM TENSILE TO NEAR ZERO, AND ALSO TO COMPRESSIVE STRESS BY ADDING TO NICKEL PLATING BATHS, SUCH AS THOSE CONTAINING NICKEL SULFATE AND NICKEL BROMIDE, AMINO NAPHTHALENE DI- AND TRI-SULFONIC ACIDS, AND NAPHTHOL DISULFONIC ACIDS AND THEIR SALTS, SUCH AS, FOR EXAMPLE, 3AMINO-2,7-NAPHTHALENEDISULFONIC ACID, AND 2-NAPHTHOL-6,8DISULFONIC ACID, AND THEIR SODIUM AND NICKEL SALTS. WHEN THE NICKEL SALTS OF THE ABOVE SULFONIC ACIDS ARE USED AS PLATING SOLUTIONS RATHER THAN IN THE SMALL AMOUNTS REQUIRE AS ADDITIVE, BRIGHT OF SEMIBRIGHT, ADHERENT AND NONPOROUS NICKEL DEPOSITS ARE FORMED AND THE STRESS OF SUCH NICKEL DEPOSITS RANGE FROM APPROXIMATELY ZERO P.S.I. TO -26,000 P.S.I. (COMPRESSIVE). SIMILAR RESULTS WERE ALSO OBTAINED WITH THE NICKEL SALTS OF BENZENESULFONIC ACID, BENZENEDISULFONIC ACIDS, NAPHTHALENESULFONIC ACIDS, AND NAPHTHALENEDISULFONIC ACIDS. PREFERABLY ALL PLATING SOLUTIONS CONTAIN NICKEL BROMIDE. THESE PLATING SOLUTIONS CAN BE USED FOR ELECTROPLATING NICKEL ON ANY SUBSTRATE, INCLUDING URANIUM.

Inventors

• 👤 J Lundquist
• 👤 R Stromatt

Bibliographic Details