US3725220A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrodeposition of copper from acidic baths
Assignee: Shipley Co Inc
•
Filing: 1972-04-27
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Granted: 1973-04-03
•
Expires: 1992-04-27
Abstract
Abstract An acid copper plating bath which contains a copper metal salt and a minor amount of a sulfoniumalkanesulfonate or sulfoniumalkanecarboxylate as a brightening agent. Illustrative sulfonium compounds are N-cyclohexyl-2-benzothiazol sulfonium-1propanesulfonate, bis (dimethylthiocarbamyl) sulfonium-1propanesulfonate, and bis (dimethylthiocarbamyl) sulfonium-1propanecarboxylate. Preferred amounts of the sulfonium compounds range from about 0.001 to 1.0 grams per liter. The use of such acid copper plating baths in the electrodeposition of copper metal is also disclosed.
Inventors
- 👤 R Kessler
- 👤 F Nobel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:12
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
30 words
In the acid copper plating bath of claim 1 wherein the sulfonium compound is added to said bath in an amount ranging from about 0.001 to 1.0 gram per liter.
Claim 2
Dependent Claim
16 words
In the acid copper plating bath of claim 1 wherein the sulfonium compound is N-cyclohexyl-2-benzothiazol sulfonium-1-propanesulfonate.
Claim 3
Dependent Claim
16 words
In the acid copper plating bath of claim 1 wherein the sulfonium compound is bis(dimethylthiocarbamyl) sulfonium-1-propanesulfonate.
Claim 4
Dependent Claim
16 words
In the acid copper plating bath of claim 1 wherein the sulfonium compound is bis(dimethylthiocarbamyl) sulfonium-1-propanecarboxylate.
Claim 5
Dependent Claim
15 words
In the acid copper plating bath of claim 1 wherein the sulfonium compound is bis(benzothiazole)sulfonium-1-propanesulfonate.
Claim 6
Dependent Claim
38 words
In the acid copper plating bath of claim 1 wherein the bath also contains a glycol selected from the group consisting of polyethylene glycol and methoxypolyethylene glycol in an amount sufficient to enhance the brightness of the electrodeposit.
Claim 7
Dependent Claim
29 words
In the acid copper plating bath of claim 7 wherein the bath also contains a triphenyl methane dye in an amount sufficient to enhance the brightness of the electrodeposit.
Claim 8
Dependent Claim
15 words
In the acid copper plating bath of claim 8 wherein the dye is Methyl Violet.
Claim 9
Dependent Claim
15 words
In the acid copper plating bath of claim 7 wherein the bath also contains 2-thiazolidienethione.
Claim 10
Dependent Claim
65 words
In a process of electrodepositing copper, the step which comprises electrolyzing an aqueous acid copper solution containing a copper metal salt and an amount, sufficient to provide a bright electrodeposit, of a sulfonium compound having the structure. wherein R is a radical selected from the group consisting of hydrogen; alkyl having from one to eight carbon atoms; aryl having from six to 12 carbon atoms;
Claim 11
Dependent Claim
22 words
In the process of claim 11 wherein the amount of the sulfonium compound ranges from about 0.001 to 1.0 gram per liter.
Claim 12
Dependent Claim
12 words
In the process of claim 11 wherein the sulfonium compound is bis(dimethylthiocarbamyl)sulfonium-1-propanesulfonate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-04-02 | 1976-10-02 | 1977-04-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-04-02 | 1980-10-02 | 1981-04-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-04-02 | 1984-10-02 | 1985-04-03 | $7700.00 | Window Closed / Lapsed |