US3720997A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Eutectic plating and breaking silicon wafers
Assignee: Motorola Solutions Inc
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Filing: 1971-01-11
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Granted: 1973-03-20
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Expires: 1991-01-11
Abstract
Abstract A WAFER OF SEMICONDUCTIVE MATERIAL IN THE NORMAL MANUFACTURE OF MAKING TRANSISTORS OR INTEGRATED CIRCUITS HAS MANY INDIVIDUAL TRANSISTORS OF IC''S PRODUCED ON ONE SIDE THEREOF AND THE OTHER SIDE THEREOF IS COATED WITH GOLD. THEN THE WAFER IS SCRIBED, USUALLY ON THE ONE SIDE THEREOF, WITH SCRIBE LINES TO ASSIST IN BREAKING THE WAFER INTO INDIVIDUAL TRANSISTOR OR IC CHIPS. AS HERE DISCLOSED A QUENCHED SILICON-GOLD ALLOY IS PRODUCED ON THE OTHER SIDE OF THE WAFER AND THE WAFER IS SCRIBED. SINCE THE QUENCHED SILICON-GOLD ALLOY IS VERY BRITTLE, THE WAFER BREAKS MORE EASILY ON THE SCRIBE LINES THAN DO PRIOR ART SCRIBED WAFERS.
Inventors
- 👤 J Black
- 👤 E Philofsky
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 08:12
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0428; H10P95/00
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-03-19 | 1976-09-18 | 1977-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-03-19 | 1980-09-18 | 1981-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-03-19 | 1984-09-18 | 1985-03-20 | $7700.00 | Window Closed / Lapsed |