Overlay for ohmic contact electrodes
Abstract
Abstract An ohmic contact electrode is overlaid with a fritless bicomponent silver or gold composition that is alloyed or soldered so as to provide a continuous layer having low lateral resistance. The overlay is composed of a sintered mixture of metal flakes approximately one-half to one micron in size and of a very fine metal powder whose particle size is between 100-1000 A. The ohmic contact electrode is on an electrical device employing an inorganic substrate of the type having a highly electronegative element adsorbed at least on the external surface thereof. The substrate is either an insulator or a semiconductor. In ohmic or low loss contact with said substrate is at least one electrode consisting of an intimate mixture of a first metal in powdered form and selected from the group consisting of the platinum group metals, gold, silver and mixtures thereof, and a second metal being an organo compound of at least one metal selected from the group consisting of calcium, magnesium, barium, strontium, zinc, tin, vanadium, nickel, indium, titanium and chromium. The mixture is alloyed and oxidized in situ with at least some of the electronegative element of said substrate.
Inventors
- 👤 M Kahn
Bibliographic Details
Claims Analysis
Total Claims: 6References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-02-20 | 1976-08-21 | 1977-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-20 | 1980-08-21 | 1981-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-20 | 1984-08-21 | 1985-02-20 | $7700.00 | Window Closed / Lapsed |