US3716909A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Improved method of soldering
Assignee: Alcoa Corp
•
Filing: 1972-04-13
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Granted: 1973-02-20
•
Expires: 1992-04-13
Abstract
Abstract An improved soldering alloy for soldered joints comprising one or more aluminum members has a base containing lead and bismuth to which is added a small amount of silver or indium. The solder alloy has a low melting point of typically less than 480*F together with very good corrosion resistance. The alloy can also contain relatively small amounts of tin, zinc and antimony.
Inventors
- 👤 R Geiger
- 👤 J Stokes
- 👤 R Cargnel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:11
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/268; B23K35/264
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
6 words
An improved method for soldering comprising
Claim 2
Dependent Claim
6 words
An improved method for soldering comprising
Claim 3
Dependent Claim
26 words
bringing the metal members to be joined into joining relationship at a joint site, at least one of said members is aluminum or an alloy thereof,
Claim 4
Dependent Claim
26 words
bringing the metal members to be joined into joining relationship at a joint site, at least one of said members is aluminum or an alloy thereof,
Claim 5
Dependent Claim
10 words
bringing said members into joining relationship at a joint site,
Claim 6
Dependent Claim
10 words
bringing said members into joining relationship at a joint site,
Claim 7
Dependent Claim
64 words
providing at said joint site a molten solder filler alloy consisting essentially of, by weight, 55 to 85 percent lead, 11 to 40 percent bismuth, said lead and bismuth totaling at least 80 percent, and at least one element selected from the group consisting of 0.5 to 5 percent silver and 0.5 to 10 percent indium, to connect said members at said joint site,
Claim 8
Dependent Claim
64 words
providing at said joint site a molten solder filler alloy consisting essentially of, by weight, 55 to 85 percent lead, 11 to 40 percent bismuth, said lead and bismuth totaling at least 80 percent, and at least one element selected from the group consisting of 0.5 to 5 percent silver and 0.5 to 10 percent indium, to connect said members at said joint site,
Claim 9
Dependent Claim
89 words
providing at said joint site a solder filler alloy consisting essentially of, by weight, 45 to 90 percent lead, 8 to 50 percent bismuth, said lead and bismuth totaling at least 80 percent, and at least one element selected from the group consisting of 0.5 to 5 percent silver and 0.5 to 10 percent indium, said filler alloy containing less than 5% tin, at a temperature sufficient to melt said filler alloy but not said members, whereby said filler alloy melts and connects said members at said joint site,
Claim 10
Dependent Claim
89 words
providing at said joint site a solder filler alloy consisting essentially of, by weight, 45 to 90 percent lead, 8 to 50 percent bismuth, said lead and bismuth totaling at least 80 percent, and at least one element selected from the group consisting of 0.5 to 5 percent silver and 0.5 to 10 percent indium, said filler alloy containing less than 5% tin, at a temperature sufficient to melt said filler alloy but not said members, whereby said filler alloy melts and connects said members at said joint site,
Claim 11
Dependent Claim
24 words
The method according to claim 1 wherein said solder filler alloy additionally contains up to 2 percent zinc and up to 1.5 percent antimony.
Claim 12
Dependent Claim
9 words
solidifying said solder filler alloy at said joint site.
Claim 13
Dependent Claim
9 words
solidifying said solder filler alloy at said joint site.
Claim 14
Dependent Claim
17 words
The method according to claim 1 wherein said solder filler alloy contains less than 0.5 percent tin.
Claim 15
Dependent Claim
5 words
solidifying said solder filler alloy.
Claim 16
Dependent Claim
5 words
solidifying said solder filler alloy.
Claim 17
Dependent Claim
17 words
The method according to claim 1 wherein said solder filler alloy contains 0.5 to 4.5 percent tin.
Claim 18
Dependent Claim
17 words
The method according to claim 1 wherein said solder filler alloy contains 0.1 to 2 percent zinc.
Claim 19
Dependent Claim
17 words
The method according to claim 1 wherein said solder filler alloy contains 0.1 to 1.5 percent antimony.
Claim 20
Dependent Claim
17 words
The method according to claim 1 wherein said solder filler alloy contains 55 to 83 percent lead.
Claim 21
Dependent Claim
14 words
The method according to claim 1 wherein the soldering is effected by dip soldering.
Claim 22
Dependent Claim
23 words
An improved method for soldering metal members, at least one of which metal members is aluminum or an alloy thereof, comprising the steps:
Claim 23
Dependent Claim
23 words
An improved method for soldering metal members, at least one of which metal members is aluminum or an alloy thereof, comprising the steps:
Claim 24
Dependent Claim
28 words
The method according to claim 9 wherein said solder filler alloy contains 73 to 83 percent lead, 14 to 22 percent bismuth and 1.5 to 4 percent silver.
Claim 25
Dependent Claim
16 words
The method according to claim 10 wherein said filler alloy contains less than 0.5 percEnt tin.
Claim 26
Dependent Claim
18 words
The method according to claim 10 wherein said solder filler alloy additionally contains 0.5 to 4.5 percent tin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-02-20 | 1976-08-21 | 1977-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-20 | 1980-08-21 | 1981-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-20 | 1984-08-21 | 1985-02-20 | $7700.00 | Window Closed / Lapsed |