US3715633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor unit with integrated circuit
Assignee: Individual
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Filing: 1971-07-15
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Granted: 1973-02-06
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Expires: 1991-07-15
Abstract
Abstract A semiconductor element. A first semiconductor body has a pair of first major surfaces on opposite sides. A first contact is provided on and covers one of the first surfaces. A socket plate is conductively connected to the other of the first surfaces and has a first contact pin. A second semiconductor body has a pair of second major surfaces and a second contact provided on and covering one of these second major surfaces. A carrier is connected with the socket plate and the second semiconductor body and located between the two. A second contact pin is provided on the second body at a side thereof facing away from the carrier and a third contact pin is provided, both the second and third contact pins penetrating the socket in insulated relationship. A connecting wire has a straight first end portion conductively secured to the second contact pin, a helically convoluted second portion conductively secured to the third contact pin, and a center portion with respect to which each of the end portions extends at an angle. An additional contact pin is provided on the first semiconductor body at a side thereof facing away from the socket plate and is in direct electrically conductive engagement with the carrier.
Inventors
- 👤 J Nier
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:35
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W40/00; H10W40/10; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/132; H10W90/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5525; H10W90/701; H10W90/751; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
242 words
A semiconductor unit, comprising a first semiconductor body having a first and a second surface on its opposite sides; a first contact provided on and covering said first surface; a heat-producing circuit provided in said first semiconductor body; a thermally and electrically conductive socket plate soldered to said first contact provided on said first surface in thermally and electrically conductive relationship and having a first contact pin; a second semiconductor body having a monolithic integrated circuit formed therein and having a first and a second major surface; a second contact provided on and covering said first surface of said second semiconductor body; a carrier connected with said socket plate and electrically insulated therefrom, said carrier also being connected with said second semiconductor body and being located between the same and said socket plate; a contact portion on said second semiconductor body on said second surface thereof facing away from said carrier, and another contact pin penetrating said socket plate in insulated relationship; a connecting wire having a straight first end portion conductively soldered to said contact portion, a helically convoluted second end portion conductively soldered to said other contact pin, and a center portion with respect to which each of said end portions extends at an angle; and an additional contact portion provided on said first semiconductor body on said second surface thereof facing away from said socket plate, said additional contact portion being in direct electrically conductive relationship with said carrier.
Claim 2
Dependent Claim
242 words
A semiconductor unit, comprising a first semiconductor body having a first and a second surface on its opposite sides; a first contact provided on and covering said first surface; a heat-producing circuit provided in said first semiconductor body; a thermally and electrically conductive socket plate soldered to said first contact provided on said first surface in thermally and electrically conductive relationship and having a first contact pin; a second semiconductor body having a monolithic integrated circuit formed therein and having a first and a second major surface; a second contact provided on and covering said first surface of said second semiconductor body; a carrier connected with said socket plate and electrically insulated therefrom, said carrier also being connected with said second semiconductor body and being located between the same and said socket plate; a contact portion on said second semiconductor body on said second surface thereof facing away from said carrier, and another contact pin penetrating said socket plate in insulated relationship; a connecting wire having a straight first end portion conductively soldered to said contact portion, a helically convoluted second end portion conductively soldered to said other contact pin, and a center portion with respect to which each of said end portions extends at an angle; and an additional contact portion provided on said first semiconductor body on said second surface thereof facing away from said socket plate, said additional contact portion being in direct electrically conductive relationship with said carrier.
Claim 3
Dependent Claim
242 words
A semiconductor unit, comprising a first semiconductor body having a first and a second surface on its opposite sides; a first contact provided on and covering said first surface; a heat-producing circuit provided in said first semiconductor body; a thermally and electrically conductive socket plate soldered to said first contact provided on said first surface in thermally and electrically conductive relationship and having a first contact pin; a second semiconductor body having a monolithic integrated circuit formed therein and having a first and a second major surface; a second contact provided on and covering said first surface of said second semiconductor body; a carrier connected with said socket plate and electrically insulated therefrom, said carrier also being connected with said second semiconductor body and being located between the same and said socket plate; a contact portion on said second semiconductor body on said second surface thereof facing away from said carrier, and another contact pin penetrating said socket plate in insulated relationship; a connecting wire having a straight first end portion conductively soldered to said contact portion, a helically convoluted second end portion conductively soldered to said other contact pin, and a center portion with respect to which each of said end portions extends at an angle; and an additional contact portion provided on said first semiconductor body on said second surface thereof facing away from said socket plate, said additional contact portion being in direct electrically conductive relationship with said carrier.
Claim 4
Dependent Claim
242 words
A semiconductor unit, comprising a first semiconductor body having a first and a second surface on its opposite sides; a first contact provided on and covering said first surface; a heat-producing circuit provided in said first semiconductor body; a thermally and electrically conductive socket plate soldered to said first contact provided on said first surface in thermally and electrically conductive relationship and having a first contact pin; a second semiconductor body having a monolithic integrated circuit formed therein and having a first and a second major surface; a second contact provided on and covering said first surface of said second semiconductor body; a carrier connected with said socket plate and electrically insulated therefrom, said carrier also being connected with said second semiconductor body and being located between the same and said socket plate; a contact portion on said second semiconductor body on said second surface thereof facing away from said carrier, and another contact pin penetrating said socket plate in insulated relationship; a connecting wire having a straight first end portion conductively soldered to said contact portion, a helically convoluted second end portion conductively soldered to said other contact pin, and a center portion with respect to which each of said end portions extends at an angle; and an additional contact portion provided on said first semiconductor body on said second surface thereof facing away from said socket plate, said additional contact portion being in direct electrically conductive relationship with said carrier.
Claim 5
Dependent Claim
99 words
A semiconductor unit as defined in claim 1, said one semiconductor body being said second semiconductor body; and wherein said integrated circuit comprises a control transistor, a resistor in parallel with the emitter-base line of said control transistor, and a Zener diode having an anode connected with the base of said control transistor, said second contact of said second semiconductor body constituting the collector contact of said control transistor, another contact of said second body constituting the cathode contact of said Zener diode and a further contact of said second body constituting the emitter contact of the control transistor.
Claim 6
Dependent Claim
29 words
A semiconductor unit as defined in claim 1, wherein said one semiconductor body is said second semiconductor body, and wherein said first semiconductor body comprises a Darlington transistor circuit.
Claim 7
Dependent Claim
140 words
A semiconductor unit as defined in claim 3, said Darlington transistor circuit comprising a driven transistor, a power transistor having a collector connected with the collector of said driven transistor and a base connected with the emitter of said driven transistor, a resistor in parallel with the emitter-base line of said driven transistor, an additional resistor in parallel with the emitter-base line of said power resistor, and a diode in parallel with the emitter-collector line of said power transistor and having an anode which is connected with the emitter of said power transistor, said first contact of said first body constituting the collector contact for both of said transistors, an additional contact of said first body constituting the base contact of said driven transistor, anD a further contact of said first body constituting the emitter contact of said power transistor.
Claim 8
Dependent Claim
26 words
A semiconductor unit as defined in claim 1, wherein said connecting wire is composed of a silver-copper alloy having a small percentage by weight of copper.
Claim 9
Dependent Claim
19 words
A semiconductor unit as defined in claim 5, wherein the composition of said alloy is Ag 97 and Cu3.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-02-06 | 1976-08-07 | 1977-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-06 | 1980-08-07 | 1981-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-06 | 1984-08-07 | 1985-02-06 | $7700.00 | Window Closed / Lapsed |