US3715258A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit die bonding apparatus
Assignee: BANCROFT H CORP
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Filing: 1971-03-23
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Granted: 1973-02-06
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Expires: 1991-03-23
Abstract
Abstract AN APPARATUS FOR SEMI-AUTOMATICALLY BOUNDING INTEGRATED CIRCUIT DIES TO LEAD FRAMES COMPRISING ADHESIVE DISPENSING MEANS, DIE ALIGNING MEANS, DIE TRANSPORT MEANS AND LEAD FRAME INDEXING MEANS. IN AN OPERATING CYCLE A METERED DROP OF CONDUCTIVE ADHESIVE IS PLACED ON A LEAD FRAME IN A LEAD FROME SRIP. THE OPERATOR THEN MICROSCOPICALLY ALIGNS AN INTEGRATED CIRCUIT DIE TO A DESIRED POSITION AND UTILIZES A VACUUM ARM TO PICK UP THE DIE AND PLACE IT ON THE ADHESIVE. SIMULTANEOUSLY ADHESIVE IS PLACED ON THE NEXT LEAD FRAME WHICH IS THEN INDEXED INTO THE OPERATIVE POSITION. D R A W I N G
Inventors
- 👤 J Cunnane
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:15
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; Y; Y10; Y10T; Y10T156/00; Y10T156/17; Y10T156/1702; Y10T156/1744; Y10T156/1746; Y10T156/1798
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-02-06 | 1976-08-07 | 1977-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-06 | 1980-08-07 | 1981-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-06 | 1984-08-07 | 1985-02-06 | $7700.00 | Window Closed / Lapsed |