Method of making an embossed panel

Claim 1

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite duplex structure of non-uniform thickness having a plastic support member with a first heat sealable plastic layer fused thereto; disposing a second heat sealable plastic layer onto a panel backing member; disposing said first and second heat sealable layers adjacent one another; and heat sealing and fusing said first and second heat sealable layers to each other to conjoin the duplex structure to the second heat sealable layer.

Claim 2

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite duplex structure of non-uniform thickness having a plastic support member with a first heat sealable plastic layer fused thereto; disposing a second heat sealable plastic layer onto a panel backing member; disposing said first and second heat sealable layers adjacent one another; and heat sealing and fusing said first and second heat sealable layers to each other to conjoin the duplex structure to the second heat sealable layer.

Claim 3

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a molding strip duplex body of non-uniform thickness having a plastic support portion with a first dielectrically heat sealable plastic layer fused thereto; disposing a second heat sealable plastic layer onto a panel backing member; disposing said first and second heat sealable plastic layers adjacent one another with the plastic support portion projecting outwardly from the surface of said second heat sealable plastic layer; placing a first die electrode against said support portion and a second die electrode against said panel backing member on the side thereof opposite said second heat sealable layer, pressing the first and second heat sealable layers together into close intimate contact, and passing a high voltage current through the materials to heat seal and fuse said first and second heat sealable layers together.

Claim 4

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a molding strip duplex body of non-uniform thickness having a plastic support portion with a first dielectrically heat sealable plastic layer fused thereto; disposing a second heat sealable plastic layer onto a panel backing member; disposing said first and second heat sealable plastic layers adjacent one another with the plastic support portion projecting outwardly from the surface of said second heat sealable plastic layer; placing a first die electrode against said support portion and a second die electrode against said panel backing member on the side thereof opposite said second heat sealable layer, pressing the first and second heat sealable layers together into close intimate contact, and passing a high voltage current through the materials to heat seal and fuse said first and second heat sealable layers together.

Claim 5

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite duplex structure of non-uniform thickness having a plastic support member with a first dielectrically heat sealable plastic layer fused thereto and having a width less than the width of the support member; disposing a second dielectrically heat sealable plastic layer onto a panel backing member; placing the first dielectrically heat sealable layer against the second dielectrically heat sealable layer with the support member projecting from the surface of the second dielectrically heat sealable layer; and passing a high voltage current through the layers of material to heat seal and fuse said dielectrically heat sealable layers together and conjoin the duplex structure to said second dielectrically heat sealable layer.

Claim 6

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite duplex structure of non-uniform thickness having a plastic support member with a first dielectrically heat sealable plastic layer fused thereto and having a width less than the width of the support member; disposing a second dielectrically heat sealable plastic layer onto a panel backing member; placing the first dielectrically heat sealable layer against the second dielectrically heat sealable layer with the support member projecting from the surface of the second dielectrically heat sealable layer; and passing a high voltage current through the layers of material to heat seal and fuse said dielectrically heat sealable layers together and conjoin the duplex structure to said second dielectrically heat sealable layer.

Claim 8

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite duplex structure of non-uniform thickness having a plastic support member with a first dielectrically heat sealable plastic layer fused thereto and having a width less than the width of the support member; placing a cover on the support member with inturned flanges between which the first dielectrically heat sealable plastic layer is exposed; disposing a second dielectrically heat sealable plastic layer onto a panel backing member; placing the first dielectrically heat sealable plastic layer against the second dielectrically heat sealable plastic layer with the inturned flanges of the cover disposed between the support member and the second heat sealable plastic layer; and passing a high voltage current through the layers of materIal to heat seal and fuse said dielectrically heat sealable layers together and conjoin the duplex structure to said second dielectrically heat sealable layer.

Claim 9

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite duplex structure of non-uniform thickness having a plastic support member with a first dielectrically heat sealable plastic layer fused thereto and having a width less than the width of the support member; placing a cover on the support member with inturned flanges between which the first dielectrically heat sealable plastic layer is exposed; disposing a second dielectrically heat sealable plastic layer onto a panel backing member; placing the first dielectrically heat sealable plastic layer against the second dielectrically heat sealable plastic layer with the inturned flanges of the cover disposed between the support member and the second heat sealable plastic layer; and passing a high voltage current through the layers of materIal to heat seal and fuse said dielectrically heat sealable layers together and conjoin the duplex structure to said second dielectrically heat sealable layer.

Claim 10

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite, dual layer molding strip of non-uniform thickness having a supporting layer composed of a plastic material that can be shaped by a dielectric heat sealing die and a first dielectrically heat sealable plastic layer fused thereto; disposing a second dielectrically heat sealable plastic layer onto a panel backing member; placing the first and second heat sealable layers together with the supporting layer projecting outwardly from the surface of said second dielectrically heat sealable layer; placing a first die electrode against said supporting layer having a form complementary with the desired configuration and surface finish of said supporting layer; placing a second die electrode against said panel backing member on the opposite side thereof from said molding strip; pressing the first and second heat sealable layers together into close intimate contact; and passing a high voltage current through the materials to heat seal and fuse said first and second heat sealable layers together and simultaneously form said support layer into said desired configuration.

Claim 11

A method of making an embossed panel comprising: dual extruding, from the same extrusion nozzle, a composite, dual layer molding strip of non-uniform thickness having a supporting layer composed of a plastic material that can be shaped by a dielectric heat sealing die and a first dielectrically heat sealable plastic layer fused thereto; disposing a second dielectrically heat sealable plastic layer onto a panel backing member; placing the first and second heat sealable layers together with the supporting layer projecting outwardly from the surface of said second dielectrically heat sealable layer; placing a first die electrode against said supporting layer having a form complementary with the desired configuration and surface finish of said supporting layer; placing a second die electrode against said panel backing member on the opposite side thereof from said molding strip; pressing the first and second heat sealable layers together into close intimate contact; and passing a high voltage current through the materials to heat seal and fuse said first and second heat sealable layers together and simultaneously form said support layer into said desired configuration.

Claim 12

A method of making an embossed panel having a heat sealable plastic layer comprising: dual extruding, from the same extrusion nozzle, a molding strip in the form of a composite duplex structure of non-uniform thickness having a relatively hard plastic supporting body with a relatively thin layer of dielectrically heat sealable plastic material fused thereto; placing the relatively soft, thin layer of dielectrically heat sealable plastic of said duplex structure against the heat sealable plastic layer of the panel; and passing a high voltage current through the molding strip and heat sealable plastic layer of the panel to heat seal and fuse the relatively soft thin layer of the duplex structure to the heat sealable plastic layer of the panel to conjoin the molding strip to the panel with the supporting body projecting outwardly therefrom.

Claim 13

A method of making an embossed panel having a heat sealable plastic layer comprising: dual extruding, from the same extrusion nozzle, a molding strip in the form of a composite duplex structure of non-uniform thickness having a relatively hard plastic supporting body with a relatively thin layer of dielectrically heat sealable plastic material fused thereto; placing the relatively soft, thin layer of dielectrically heat sealable plastic of said duplex structure against the heat sealable plastic layer of the panel; and passing a high voltage current through the molding strip and heat sealable plastic layer of the panel to heat seal and fuse the relatively soft thin layer of the duplex structure to the heat sealable plastic layer of the panel to conjoin the molding strip to the panel with the supporting body projecting outwardly therefrom.