US3714704A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer spreader
Assignee: Hugle Ind Inc
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Filing: 1970-08-31
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Granted: 1973-02-06
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Expires: 1990-08-31
Abstract
Abstract A METHOD FOR SEPARATING PIECES (DIES) OF A SEMICONDUCTOR WAFER IN WHICH THE WAFER IS ATTACHED TO A VINYL FILM, SCRIBED, BROKEN, AND THE FILM STRETCHED IN ALL RADIAL DIMENSIONS. A PLUNGER-TYPE DEVICE HAVING A ROUNDED CHAMBER IN CONTACT WITH THE FILM AND A TEFLON OR NYLON SURFACE IS USED TO STRETCH THE FILM RADIALLY BY DEFORMING IT AXIALLY. THE FILM IS HEATED FOR ATTACHING THE WAFER AND FOR THE STRETCHING PROCESS. A VACUUM STEP MAY BE EMPLOYED TO ENHANCE WAFER-FILM ADHERENCE.
Inventors
- 👤 A Moore
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 14:50
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0442
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-02-06 | 1976-08-07 | 1977-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-02-06 | 1980-08-07 | 1981-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-02-06 | 1984-08-07 | 1985-02-06 | $7700.00 | Window Closed / Lapsed |