US3713068A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonded assemblies and methods of making the same
Assignee: TDK Micronas GmbH
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Filing: 1971-06-07
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Granted: 1973-01-23
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Expires: 1991-06-07
Abstract
Abstract A transducer assembly including a laminate of a silicon strain gauge and a nickel steel cantilever beam bonded together with a sheet of glass of a critical thickness. The method of the invention includes the step of applying a DC voltage across the joints to be bonded during a heating step. Improved bonds are obtained by the use of field distributing auxiliary glass. The use of a P-N junction type silicon strain gauge also improves the bond and avoids warpage.
Inventors
- 👤 R Talmo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 20:15
CPC Classifications
C; C03; C03C; C03C27/00; C03C27/02; C03C27/04; C03C27/042; C03C27/044; C03C29/00; G; G01; G01L; G01L1/00; G01L1/20; G01L1/22; G01L1/2287
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
50 words
The invention as defined in claim 1, wherein the main glass member is a horizontal sheet of glass supported underneath by the metal member, said auxiliary glass member being located on top of the main glass member, said source being connected to the top surface of said auxiliary glass member.
Claim 2
Dependent Claim
16 words
The invention as defined in claim 2, wherein said source indicates a DC source of potential.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-01-23 | 1976-07-24 | 1977-01-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-01-23 | 1980-07-24 | 1981-01-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-01-23 | 1984-07-24 | 1985-01-23 | $7700.00 | Window Closed / Lapsed |