Method of anchoring and connecting lead wires to an electrical component

Claim 1

A method of connecting a lead wire to an electrical device supported on a surface of a substrate having a plurality of notches, each of said notches having a top opening communicating with the top surface of the substrate and a front opening communicating with the front surface of the substrate, each of said notches having walls forming a constricted section and an enlarged section, said constricted section being disposed between one of said surfaces and said enlarged section, the method comprising: depositing a conductive coating around a portion of the edge of one of said openings of one of said notches to form a conductive pad, electrically connecting said electrical device to said pad, covering at least a portion of the walls of said one of said notches with a conductive coating, placing an end portion of a lead wire over said one of said openings, applying a force against the lead wire and simultaneously forcing the lead wire into said one of said notches and deforming said portion of the lead wire and altering the cross section of the lead wire to conform at least partially to the enlarged and constricted sections of said one of said notches and thereby securing said wire against both axial and normal forces, and depositing conductive material in said one of said notches for electrically connecting the end portion of the lead wire to said conductive pad.

Claim 2

A method of connecting a lead wire to an electrical device supported on a surface of a substrate having a plurality of notches, each of said notches having a top opening communicating with the top surface of the substrate and a front opening communicating with the front surface of the substrate, each of said notches having walls forming a constricted section and an enlarged section, said constricted section being disposed between one of said surfaces and said enlarged section, the method comprising: depositing a conductive coating around a portion of the edge of one of said openings of one of said notches to form a conductive pad, electrically connecting said electrical device to said pad, covering at least a portion of the walls of said one of said notches with a conductive coating, placing an end portion of a lead wire over said one of said openings, applying a force against the lead wire and simultaneously forcing the lead wire into said one of said notches and deforming said portion of the lead wire and altering the cross section of the lead wire to conform at least partially to the enlarged and constricted sections of said one of said notches and thereby securing said wire against both axial and normal forces, and depositing conductive material in said one of said notches for electrically connecting the end portion of the lead wire to said conductive pad.

Claim 3

A method of connecting a lead wire to an electrical device supported on a surface of a ceramic dielectric substrate having a plurality of notches, each of the notches having a top opening communicating with a top surface of the substrate and a front opening communicating with a front surface of the substrate, each of said notches having a constricted section and an enlarged section, said constricted section being disposed between one of said surfaces and said enlarged section, the method comprising: depositing a conductive coating around a portion of the edge of one of said openings of one of said notches to form a conductive pad, electrically connecting said electrical device to said pad, placing an end portion of the lead wire into said one of said notches by applying a force normal to the axis of the lead wire and against the end portion thereof and simultaneously deforming the end portion of the lead wire and altering the cross section of the lead wire to conform at least partially to the enlarged and constricted sections of said one of said notches, and depositing conductive material in said one of said notches for electrically connecting the end of the lead wire to said conductive pad.

Claim 4

A method of connecting a lead wire to an electrical device supported on a surface of a ceramic dielectric substrate having a plurality of notches, each of the notches having a top opening communicating with a top surface of the substrate and a front opening communicating with a front surface of the substrate, each of said notches having a constricted section and an enlarged section, said constricted section being disposed between one of said surfaces and said enlarged section, the method comprising: depositing a conductive coating around a portion of the edge of one of said openings of one of said notches to form a conductive pad, electrically connecting said electrical device to said pad, placing an end portion of the lead wire into said one of said notches by applying a force normal to the axis of the lead wire and against the end portion thereof and simultaneously deforming the end portion of the lead wire and altering the cross section of the lead wire to conform at least partially to the enlarged and constricted sections of said one of said notches, and depositing conductive material in said one of said notches for electrically connecting the end of the lead wire to said conductive pad.

Claim 5

A method of connecting a lead wire to an electrical device supported on a surface of a ceramic dielectric substrate having a plurality of notches, each of said notchEs having a top opening communicating with a top surface of the substrate and a front opening communicating with a front surface of the substrate, each of said notches having a constricted section and an enlarged section, said constricted section being disposed between one of said surfaces and said enlarged section, the method comprising: depositing a conductive coating around a portion of the edge of one of said openings of one of said notches to form a conductive pad, electrically connecting said electrical device to said pad, preforming a portion of the lead wire, placing a portion of the preformed lead wire over one of the openings of one of said notches, and applying a force against the lead wire and simultaneously forcing the lead wire into said one of said notches and deforming said portion of the lead wire and altering the cross section of the lead wire to conform at least partially to the enlarged and constricted sections of said one of said notches, electrically connecting the end of the lead wire to said conductive pad.

Claim 6

A method of connecting a lead wire to an electrical device supported on a surface of a ceramic dielectric substrate having a plurality of notches, each of said notchEs having a top opening communicating with a top surface of the substrate and a front opening communicating with a front surface of the substrate, each of said notches having a constricted section and an enlarged section, said constricted section being disposed between one of said surfaces and said enlarged section, the method comprising: depositing a conductive coating around a portion of the edge of one of said openings of one of said notches to form a conductive pad, electrically connecting said electrical device to said pad, preforming a portion of the lead wire, placing a portion of the preformed lead wire over one of the openings of one of said notches, and applying a force against the lead wire and simultaneously forcing the lead wire into said one of said notches and deforming said portion of the lead wire and altering the cross section of the lead wire to conform at least partially to the enlarged and constricted sections of said one of said notches, electrically connecting the end of the lead wire to said conductive pad.