Solder leveling method
Abstract
Abstract THIS INVENTION, RELATING TO A METHOD FOR ESTABLISHING A LEVEL COATING OF SOLDER OF UNIFORM THICKNESS ON METALLIC SURFACES SUCH AS THE CIRCUITRY OF PRONTED CIRCUIT BOARDS, UTILIZES A TANK CONTAINING A VOLUME OF FLUID MAINTAINED AT A TEMPERATURE SUBSTANTIALLY ABOVE THAT OF THE MELTING POINT OF THE SOLDER WITH A CONVEYOR CARRYING THE METALLIC SURFACES, SUCH AS PRINTED CIRCUIT BOARDS, ACROSS THE TOP OF THE TANK AND A PUMP SUBMERGED IN THE HOT FLUID DIRECTING A CONVERGING SPRAY OF HOT FLUID AT AN ACUTE ANGLE ONTO BOTH SIDES OF THE METALLIC SURFACES OPPOSITE THEIR DIRECTION OF MOTION AS THEY PASS ACROSS THE TOP OF THE TANK. OIL OR A MOLTEN SALT IS UTILIZED AS THE FLUID. D R A W I N G
Inventors
- 👤 John H Mclain
- 👤 Bobby J Porter
Bibliographic Details
Claims Analysis
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-11-28 | 1976-05-29 | 1976-11-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-11-28 | 1980-05-29 | 1980-11-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-11-28 | 1984-05-29 | 1984-11-28 | $7700.00 | Window Closed / Lapsed |