Polyester film with phenoxy resin coating
Abstract
Abstract THIS APPLICATION DESCRIBES A PROCESS FOR THE PRODUCTION OF FILM BASE MATERIAL WHCH COMPRISES TREATING ONE SIDE OF A FILM OF SYNTHETIC LINEAR POLYESTER OF HIGHLY HYDROPHOBIC CHARACTER WITH AN ORGANIC SOLVENT SOLUTION OF A PHENOLIC ADHESION PROMOTIONG AGENT, REMOVING THE SOLVENT AND COATING ON TO THE TREATED SIDE AN ORGANIC SOLVENT SOLUTION OF AN ORGANIC DICARBOXYLIC ACID HALF ESTER OF A PHENOXY RESIN WHICH HAS THE FORMULA: C(-R5)(-O-R8)-C(-R6)(-R7))N- -(O-1,4-PHENYLENE-C(-R1)(-R2)-1,4-PHENYLENE-O-C(-R3)(-R4)- WHEREIN EACH OF R1-R7 IS A HYDROGEN ATOM OR A LOWER ALKYL OR CYCLOHEXYL GROUP, R8 IS A HYDROGEN ATOM OR REPRESENTS THE ACYL RESIDUE OF A HALF ESTER OF AN ORGANIC DICARBOXYLIC ACID, N IS AT LEAST 50, AND FROM 10 TO 95% OF THE R8 GROUPS ARE A SAID ACYL RESIDUE.
Inventors
- 👤 Edward William Lee
- 👤 Keith Reid Tatchell
- 👤 Kenneth John Challis
- 👤 Kenneth Archibald Cockerton
Bibliographic Details
Claims Analysis
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