US3700469A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless gold plating baths
Assignee: AT&T Inc
•
Filing: 1971-03-08
•
Granted: 1972-10-24
•
Expires: 1991-03-08
Abstract
Abstract CONDITIONS AND BATH COMPOSITIONS ARE GIVEN FOR ELECTROLESS PLATING OF PURE GOLD AND GOLD ALLOYS ON A VARIETY OF SUBSTRATES INCLUDING ONES WITH GOLD SURFACES. THE PLATING BATH CONTAINS A GOLD CYANIDE COMPLEX, AND FREE CYANIDE IS ADDED TO STABILIZE THIS COMPLEX. A BOROHYDRIDE OR ALIPHATIC-SUBSTITUTED AMINE BORANE IS USED AS THE REDUCING AGENT AND THE PH IS ADJUSTED BY THE ADDITION OF AN ALKALINE AGENT. THE RESULTING BATH IS STABLE,YIELDS PLATING RATES OF TYPICALLY 0.5 TO 3 MICRONS PER HOUR AT ABOUT 75*C. AND PLATING THICKNESS UP TO A MICRON OR GREATER. D R A W I N G
Inventors
- 👤 Yutaka Okinaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:38
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/42; C23C18/44
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-24 | 1976-04-24 | 1976-10-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-24 | 1980-04-24 | 1980-10-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-24 | 1984-04-24 | 1984-10-24 | $7700.00 | Window Closed / Lapsed |