US3699394A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Modular circuit package with enhanced heat dissipation
Assignee: Powercube Corp
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Filing: 1971-11-01
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Granted: 1972-10-17
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Expires: 1991-11-01
Abstract
Abstract A modular electronic power circuit package having the individual circuit components mounted to a carrier which is secured to a base member. The carrier and base member provide a direct path to the chassis for dissipation of heat generated by circuit components, some of which may be physically connected to the carrier. Modular ceramic elements may be selectively utilized within the enclosure to provide physical and thermal connection and electrical insulation between the carrier and selective circuitry components. A preferred embodiment includes a housing within which one or more modular circuits and carriers may be mounted. The housing provides for various external physical mountings, and several housings (with sub-circuits) may be interconnected and mechanically secured together to form more complex power circuit combinations. The complete enclosure effectively shields against radio frequency interference while enhancing heat dissipation.
Inventors
- 👤 Chester L Schuler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 13:28
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/06; H05K5/062; H05K5/064; H05K7/00; H05K7/20; H05K7/2039; H05K7/20436; H05K7/20445; H05K7/20463; H05K9/00; H05K9/0007; H05K9/002
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
95 words
A modular circuit package comprising: a base member having a substantially flat outer surface and a serrated inner surface spaced from and parallel to said outer surface; a carrier mounted to said base member, said carrier having a serrated outer surface and a substantially flat inner surface generally parallel to and spaced from said outer surface, said serrations thereon meshing with the serrations on said spaced member; a relatively thin layer of electrically insulating material between and separating said base member from said carrier; and electronic components comprising a modular circuit mounted to said carrier.
Claim 2
Dependent Claim
95 words
A modular circuit package comprising: a base member having a substantially flat outer surface and a serrated inner surface spaced from and parallel to said outer surface; a carrier mounted to said base member, said carrier having a serrated outer surface and a substantially flat inner surface generally parallel to and spaced from said outer surface, said serrations thereon meshing with the serrations on said spaced member; a relatively thin layer of electrically insulating material between and separating said base member from said carrier; and electronic components comprising a modular circuit mounted to said carrier.
Claim 3
Dependent Claim
23 words
The modular circuit package recited in claim 1 wherein said electrically insulating layer comprises an anodized coating on one of said serrated surfaces.
Claim 4
Dependent Claim
24 words
The modular circuit package recited in claim 2 and further comprising at least one circuit board for interconnection of some of said electronic components.
Claim 5
Dependent Claim
25 words
The modular circuit package recited in claim 3 and further comprising external electrical leads extending upwardly therefrom, said leads being connected to said modular circuit.
Claim 6
Dependent Claim
179 words
The modular circuit package recited in claim 1 wherein said serrations on said base member are formed with relatively straight generally inwardly extending sides formed at an angle with said outer surface thereof, two of said generally inwardly extending adjacent sides being joined by a relatively narrow land, there being a U-shaped channel between each of said serrations joining the bases of two of said generally inwardly extending adjacent sides; said serrations on said carrier are formed with relatively straight generally outwardly extending sides formed at an angle with said inner surface thereof, two of said generally outwardly extending adjacent sides being joinEd by a relatively narrow land, there being a relatively narrow flat groove between each of said serrations joining the bases of two of said generally outwardly extending adjacent sides; whereby a space exists between the land on each serration of said base and the groove between each serration on said carrier and an open channel exists between said U-shaped channel between said serration on said base and said land on each said serration on said carrier.
Claim 7
Dependent Claim
59 words
The modular circuit package recited in claim 1 and further comprising at least one thermally conductive, electrically insulating pad secured to said carrier, at least one of said electronic components being mounted to said thermally conductive, electrically insulating pad thereby providing a direct path for heat dissipation from said component through said pad and said carrier to said base.
Claim 8
Dependent Claim
37 words
The modular circuit package recited in claim 1 and further comprising a housing mechanically and electrically connected to said base, said carrier and said modular circuit being physically and electrically separated from said housing and located therewithin.
Claim 9
Dependent Claim
49 words
The modular circuit package recited in claim 7 wherein the interior walls of said housing are formed with serrations having relatively sharp inner projecting peaks, said housing further being formed with external key-shaped slots at opposite sides thereof, said slots extending completely through said housing from top to bottom.
Claim 10
Dependent Claim
60 words
The modular circuit package recited in claim 8 wherein said base member is formed with marginal areas on its upper surface which are free of said serrations, said marginal areas making contact with peripheral portions of the bottom surface of said housing for physically mounting thereto, said serrations extending into said housing and making interference-fit contact with said housing serrations.
Claim 11
Dependent Claim
84 words
The modular circuit package recited in claim 9 wherein the outermost serrations on said base member adjacent said marginal areas are formed with a relatively sharp edge projecting laterally and an undercut between said marginal area and said serrations thereby providing flexibility of said relatively sharp laterally extending edge of said serrations wherein said serrations on the inner sides of said housing form an interference fit with said relatively sharp edges thereby making positive physical and electrical contact between said housing and said base.
Claim 12
Dependent Claim
49 words
The modular circuit package recited in claim 1 and further comprising an encapsulant of suitable material which is electrically insulating and has a thermal coefficient of expansion substantially similar to that of said base and carrier members, said encapsulant enclosing said electronic components to form a substantially solid mass.
Claim 13
Dependent Claim
53 words
The modular circuit package recited in claim 10 and further comprising an encapsulant of suitable material which is electrically insulating and has a thermal coefficient of expansion substantially similar to that of said enclosure, said encapsulant filling that portion of the interior of said enclosure not otherwise occupied by said modular circuit components.
Claim 14
Dependent Claim
37 words
The modular circuit package recited in claim 8 wherein said key-shaped slots are adapted to receive bolts for connecting said modular circuit package to other elements, said key-shaped slots being alternatively adapted for use as cooling fins.
Claim 15
Dependent Claim
90 words
A modular circuit package comprising: a base member having a substantially flat outer surface and a serrated inner surface parallel with and spaced from said outer surface; a plurality of carriers mounted to said base member, each said carrier having one serrated outer surface and one substantially flat inner surface parallel thereto and spaced therefrom, said serrations on said carriers meshing with the serrations on said base member; means for electrically insulating said carriers from said base member; and electronic components comprising modular circuits mounted to each of said carriers.
Claim 16
Dependent Claim
90 words
A modular circuit package comprising: a base member having a substantially flat outer surface and a serrated inner surface parallel with and spaced from said outer surface; a plurality of carriers mounted to said base member, each said carrier having one serrated outer surface and one substantially flat inner surface parallel thereto and spaced therefrom, said serrations on said carriers meshing with the serrations on said base member; means for electrically insulating said carriers from said base member; and electronic components comprising modular circuits mounted to each of said carriers.
Claim 17
Dependent Claim
24 words
The mOdular circuit package recited in claim 14 wherein said electrically insulating means is a coating of anodization on one of said serrated surfaces.
Claim 18
Dependent Claim
35 words
The modular circuit package recited in claim 15 and further comprising at least one circuit board coextensive with said plurality of carriers and interconnecting in an appropriate manner said circuits mounted to said individual carriers.
Claim 19
Dependent Claim
46 words
The modular circuit package recited in claim 16 wherein each of said carriers and said modular circuits mounted thereto are physically separated and electrically isolated from each of the other of said carriers and modular circuits except where appropriate interconnections are made by said circuit board.
Claim 20
Dependent Claim
28 words
The modular circuit package recited in claim 7 wherein two opposite walls of said housing are formed with indentations along said walls adjacent one end of said housing.
Claim 21
Dependent Claim
170 words
A modular circuit package comprising: a plurality of housings each having an opening therethrough and having serrations on its internal walls; a like plurality of base members having a substantially flat outer surface and a serrated inner surface parallel with and spaced from said outer surface, said base member being secured to said housing to substantially cover one open end thereof, said serrations on said base being closely adjacent said serrations on said housing walls; a plurality of carriers each having one serrated surface and one substantially flat surface parallel thereto and spaced therefrom, said serrations on said carriers meshing with said serrations on said base members; means electrically insulating said carriers from said base members; electronic components comprising a plurality of modular circuits, one of said circuits being mounted to each of said carriers; and a cover secured to all of said housings, said housings being placed in abutting side by side relation to thereby form a single power modular circuit package comprised of said second plurality of sub-circuits.
Claim 22
Dependent Claim
170 words
A modular circuit package comprising: a plurality of housings each having an opening therethrough and having serrations on its internal walls; a like plurality of base members having a substantially flat outer surface and a serrated inner surface parallel with and spaced from said outer surface, said base member being secured to said housing to substantially cover one open end thereof, said serrations on said base being closely adjacent said serrations on said housing walls; a plurality of carriers each having one serrated surface and one substantially flat surface parallel thereto and spaced therefrom, said serrations on said carriers meshing with said serrations on said base members; means electrically insulating said carriers from said base members; electronic components comprising a plurality of modular circuits, one of said circuits being mounted to each of said carriers; and a cover secured to all of said housings, said housings being placed in abutting side by side relation to thereby form a single power modular circuit package comprised of said second plurality of sub-circuits.
Claim 23
Dependent Claim
48 words
The modular circuit package recited in claim 19 and further comprising a circuit board coextensive with the adjacent top surfaces of said plurality of housings, said circuit board being secured between said cover and said housings, said circuit board providing electrical interconnection for said sub-circuits within said housings.
References Cited (Backward Citations)
US3164750A
Cited
US3328642A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-17 | 1976-04-17 | 1976-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-17 | 1980-04-17 | 1980-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-17 | 1984-04-17 | 1984-10-17 | $7700.00 | Window Closed / Lapsed |