US3699010A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Beam lead plating process
Assignee: Boeing North American Inc
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Filing: 1971-03-22
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Granted: 1972-10-17
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Expires: 1991-03-22
Abstract
Abstract A NICKEL (OR COPPER) LAYER ON THE SURFACE OF A SEMICONDUCTOR WAFER IS ETCHED TO DEFINE A PATTERN FOR THE CANTILEVERED POTIONS OF BEMA LEADS. THE REMAINING PORTION OF THE LAYER IS NOT REMOVED FOR PROVIDING AN IMPROVED ELECTRICAL CONDUCTOR ON THE SURFACE OF THE SEMICONDUCTOR WAFER WHEN GOLD BEAM LEADS ARE SUBSEUENTLY ELECTRODEPOSITED.
Inventors
- 👤 Michael T Nash
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:12
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/60; H10P; H10P95/00
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-17 | 1976-04-17 | 1976-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-17 | 1980-04-17 | 1980-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-17 | 1984-04-17 | 1984-10-17 | $7700.00 | Window Closed / Lapsed |