US3698976A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for sorting die
Assignee: TDK Micronas GmbH
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Filing: 1971-03-19
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Granted: 1972-10-17
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Expires: 1991-03-19
Abstract
Abstract THIS IS A METHOD OF REMOVING UNWANTED DIE, WHICH DIE ARE FORMED AT THE PERIPHERY OF A WAFER, FROM THE REMAINING DIE WHICH ARE FORMED WITHIN THAT PERIPHERY. THIS IS ACCOMPLISHED BY ATTACHING THE WAFER TO A SUITABLE BACKING MATERIAL USING A GLUE WHICH IS SOLUBLE IN WATER, ALCOHOL OR TRICHOROETHYLENE. THE WAFER IS SCRIBED AND FRACTURED INTO INDIVIDUAL DIE, AND A RING OF CEMENT IS PLACED ALONG THE PERIPHERY OF THE WAFER, WHICH CEMENT IS NOT SOLUBLE IN THE ABOVE REFERRED TO SOLVENTS. THE WAFER IS DIPPED IN ONE OF THE ABOVE SOLVENTS SOT THAT THE OUTER PERIPHERY OF UNWANTED DIE STICK TOGETHER AND THE REMAINING DIE ARE INDIVIDUALLY REMOVED.
Inventors
- 👤 Nelson E Ake
- 👤 Harry C Kling
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 20:19
CPC Classifications
B; B07; B07C; B07C5/00; B07C5/34; B07C5/344; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-17 | 1976-04-17 | 1976-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-17 | 1980-04-17 | 1980-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-17 | 1984-04-17 | 1984-10-17 | $7700.00 | Window Closed / Lapsed |