Method of applying leads to an integrated circuit

Claim 1

In a method for the machine assembly of semiconductor devices utilizing in said method a plurality of semiconductor chips each having a plurality of contact pads thereon and two strips which are movable through the machine, one of said strips being of plastic which is imperforate in the body portion thereof and having adhesive on one side of such body position and one strip being of metal and having a plurality of spaced-apart groups of preformed leads in each group, the steps of moving the metal strip through said machine and securing a semiconductor chip to the inner end of each lead in a group of leads to provide an assembly of a chip and secured leads, repeating said securing step for a plurality of chips and corresponding groups of leads in the metal strip to provide a plurality of assemblies, moving said plastic strip in said machine and bringing the adhesive in engagement with one side of each lead-chip assembly and the corresponding side of the metal strip, separating in a severing action excess metal from the metal strip which is outside each group of leads in an assembly without perforating the plastic strip, removing from the machine the metal strip comprising the excess metal, and accumulating onto a supporting means the plastic strip with the plurality of lead-chip assemblies thereon whereby the supporting means may be independently handled with the plastic strip and assemblies therewith.

Claim 3

A method utilizing assembly apparatus for the fabrication of a plurality of semiconductor devices in a substantially continuous process which includes providing a plurality of semiconductor chips with contact pads thereon, providing a strip with adhesive on one side thereof and providing first and second metal strips each having a plurality of spaced-apart groups of leads preformed therein over the length thereof, each group of leads corresponding to the electrical connections required for a semiconductor device, moving said first metal strip through said apparatus, securing each of a plurality of chips at the contact pads thereof to corresponding leads in a group with said first metal strip, moving said adhesive strip into engagement on the adhesive side thereof with said first metal strip, said adhesive strip acting as a carrier for said first metal strip, severing from said first strip the excess metal outside the leads of each group while maintaining the leads and chip assembly with each group adhered to said adhesive and maintaining said excess metal in a continuous structure in said first metal strip, separating said excess metal continuous structure from said adhesive while said adhesive strip continues to be moved through said apparatus, moving said second metal strip into said apparatus and aligning the leads of a group in said second strip with the outer ends of the leads in a corresponding group in said first strip, securing together into a semiconductor device assembly the leads of respective groups in each the first and the second metal strips, and substantially coincidentally with said latter securing separating the adhesive strip and said first metal strip leads, and thereafter separating each semiconductor device assembly from said second strip.

Claim 4

A method utilizing assembly apparatus for the fabrication of a plurality of semiconductor devices in a substantially continuous process which includes providing a plurality of semiconductor chips with contact pads thereon, providing a strip with adhesive on one side thereof and providing first and second metal strips each having a plurality of spaced-apart groups of leads preformed therein over the length thereof, each group of leads corresponding to the electrical connections required for a semiconductor device, moving said first metal strip through said apparatus, securing each of a plurality of chips at the contact pads thereof to corresponding leads in a group with said first metal strip, moving said adhesive strip into engagement on the adhesive side thereof with said first metal strip, said adhesive strip acting as a carrier for said first metal strip, severing from said first strip the excess metal outside the leads of each group while maintaining the leads and chip assembly with each group adhered to said adhesive and maintaining said excess metal in a continuous structure in said first metal strip, separating said excess metal continuous structure from said adhesive while said adhesive strip continues to be moved through said apparatus, moving said second metal strip into said apparatus and aligning the leads of a group in said second strip with the outer ends of the leads in a corresponding group in said first strip, securing together into a semiconductor device assembly the leads of respective groups in each the first and the second metal strips, and substantially coincidentally with said latter securing separating the adhesive strip and said first metal strip leads, and thereafter separating each semiconductor device assembly from said second strip.