Electroplating processes and compositions
Abstract
Abstract (A) PRIMARY BRIGHTENER (B) SECONDARY BRIGHTENER (C) SECONDARY AUXILIARY BRIGHTENER (D) ANTI-PITTING AGENT; AND (2) AN ORGANIC HYDROXY-SULFONATE COMPOUND OF THE FORMULA: (R-CH(-OH)-SO3(-))K M WHEREIN M IS A CATION HAVING A VALENCE OF 1-2; K IS AN INTEGER 1-2 CORRESPONDING TO THE VALENCE OF M; AND R IS HYDROGEN OR A MONOVALENT ALIPHATIC GROUP OF 1-16 CARBON ATOMS; FOR A TIME PERIOD SUFFICIENT TO FORM A SOUND METAL ELECTROPLATE UPON SAID CATHODE SURFACE. IN ACCORDANCE WITH CERTAIN OF ITS ASPECTS, THIS INVENTION RELATES TO A PROCESS FOR THE PREPARATION OF AN ELECTRODEPOSIT WHICH CONTAINS AT LEAST ONE METAL SELECTED FROM THE GROUP CONSISTING OF NICKEL AND COBALT WHICH COMPRISES PASSING CURRENT FROM AN ANODE TO A CATHODE THROUGH AN AQUEOUS PLATING SOLUTION CONTAINING A MEMBER SELECTED FROM THE GROUP CONSISTING OF COBALT COMPOUNDS AND NICKEL COMPOUNDS PROVIDING COBALT OR NICKEL IONS FOR ELECTRODEPOSITING COBALT OR NICKEL AND CONTAINING IN COMBINATION AN EFFECTIVE AMOUNT OF: (1) AT LEAST ONE MEMBER SELECTED FROM THE GROUP OF COOPERATING ADDITIVES CONSISTING OF:
Inventors
- 👤 Frank Passal
Bibliographic Details
Claims Analysis
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