Abstract A hermetically sealed enclosure for a semiconductor device and a method and apparatus for making same is disclosed. A tubular ceramic housing is provided with an integral die on one end. A cold weldable layer is brazed on the integral die. A first cover member is brazed onto the other end providing a hermetic seal there. A second cover member is cold welded to the layer hermetically sealing the one end. The cold welding apparatus includes a pressure equalizing assembly having a pair of spaced resiliently coupled elements with facing hemispherical recesses. One of the elements slides on a bearing ball nested within the recesses to equalize the compressive forces of the cold welding around the end of the housing.
A hermetically sealed enclosure for a semiconductor device which comprises a tubular ceramic housing having a radial periphery and first and second opposite end faces, a first cover member brazed to the first end face and hermetically sealing the first end of the housing, a continuous circumferential annular integral projection on said second end face of said housing, said projection providing an annular integral cold welding die with an axial face on the second end of said housing, a cold weldable layer, about 10 - 40 mils thick, brazed completely around the circumference of the die face, a second cover member having a radially extending circumferential rim about 10 - 40 mils thick, said rim overlapping and cold welded to said brazed layer completely around the circumference of the die face to hermetically seal said housing within its radial periphery.
Claim 2
Dependent Claim
45 words
The enclosure as recited in claim 2 wherein the cold weldable layer is a copper ring about 25 mils thick substantially coextensive with the die face and the rim of the second cover member adjacent the cold weld region is copper about 25 mils thick.