Process for forming an isolated circuit pattern on a conductive substrate
Abstract
Abstract A METAL PLATE WITH PUNCHED THROUGH HOLES IS USED AS THE SUBSTRATE FOR A PRINTED CIRCUIT BOARD BY APPLYING A FIRST COATING OF AN EPOXY POLYMER FROM A FLUIDIZED BED OF EPOXY POWDER AND THEN CURED THEREON. THE CURED EPOXY COATING IS THEN ABRADED. A SECOND AND THIRD COATING OF A PHENOLIC MIXTURE IS APPLIED OVER THE FIRST COAT BY DIPPING AND DRYING RESPECTIVELY IN SEQUENCE IN A LIQUID TANK OF A PHENOLIC MIXTURE. THE DOUBLE LAYER OF PARTIALLY CURED PHENOLIC MIXTURE IS ABRADED AND SOAKED WITH WATER OR CHEMICALLY TREATED WITH A MILD ACIDIC AQUEOUS SOLUTION BEFORE CONVENTIONAL ELECTROLESS DEPOSTION THEREON PREPARATORY TO ELECTROLYTICALLY DEPOSITING A PRINTED CIRCUIT OF DESIRED CONFIGURATION.
Inventors
- 👤 Robert Ritter Russo
Bibliographic Details
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