US3679946A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Strip mounted semiconductor device
Assignee: Motors Liquidation Co
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Filing: 1970-07-06
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Granted: 1972-07-25
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Expires: 1990-07-06
Abstract
Abstract A semiconductor package assembly and method of making it. A semiconductive element is mounted on a flat strip. A portion of the strip is partially separated from, and raised above the plane of, the strip. The raised portion is eventually completely separated from the strip, and forms a terminal member for the semiconductive element. The element and connection to the terminal are enclosed, perferably in a plastic potting. Means are provided to increase the rigidity of the strip in the enclosure area. Means are also provided to enhance adhesion of a plastic potting to the strip and terminal members. A plurality of devices can be simultaneously or successively formed from a single strip. Multiple terminal devices can be formed using adjacent multiple raised portions on the strip.
Inventors
- 👤 Robert E Buck
- 👤 Robert W Metzger Jr
- 👤 Albert D Rittmann
- 👤 Eugene H Sayers
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 22:14
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/481; H10W70/461; H10W72/00; H10W72/01; H10W72/0198; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/12; Y10T428/12188; Y10T428/12194; Y10T428/12201; Y10T428/12361; Y10T428/12368; Y10T428/12431; Y10T428/12493; Y10T428/12528; Y10T428/12771; Y10T428/12861; Y10T428/12889; Y10T428/12903
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
243 words
An encapsulated semiconductor device comprising a flat metal strip having a main portion and a wider end portion of a given length, an elongated metal terminal member laterally adjacent to and parallel the length of said main strip portion, said metal strip and said terminal member being strips of the same metal and thickness, said terminal member having a length about equal to that of said strip main portion and a width about equal to the difference in width between the wider end portion of said strip and said main portion, a first part of said terminal member out of the plane of said strip, a second part of said terminal member in a common plane with said strip, an intermediate part of the terminal member bent about an axis transverse the terminal member and said strip, a semiconductor element on a central region of one major surface of said strip main portion adjacent said first terminal member part, a filamentary wire lead interconnecting said semiconductive element and said first terminal member part, means on said strip main portion for inhibiting binding of said central surface region, means on said strip for enhancing adhesion of encapsulating plastic to the strip, plastic encapsulation enveloping only said first terminal member part, said semiconductor element, said filamentary lead and said central surface region, leaving exposed the opposite major surface of said metal strip, ends of said metal strip and the second part of said terminal member.
Claim 2
Dependent Claim
243 words
An encapsulated semiconductor device comprising a flat metal strip having a main portion and a wider end portion of a given length, an elongated metal terminal member laterally adjacent to and parallel the length of said main strip portion, said metal strip and said terminal member being strips of the same metal and thickness, said terminal member having a length about equal to that of said strip main portion and a width about equal to the difference in width between the wider end portion of said strip and said main portion, a first part of said terminal member out of the plane of said strip, a second part of said terminal member in a common plane with said strip, an intermediate part of the terminal member bent about an axis transverse the terminal member and said strip, a semiconductor element on a central region of one major surface of said strip main portion adjacent said first terminal member part, a filamentary wire lead interconnecting said semiconductive element and said first terminal member part, means on said strip main portion for inhibiting binding of said central surface region, means on said strip for enhancing adhesion of encapsulating plastic to the strip, plastic encapsulation enveloping only said first terminal member part, said semiconductor element, said filamentary lead and said central surface region, leaving exposed the opposite major surface of said metal strip, ends of said metal strip and the second part of said terminal member.
Claim 3
Dependent Claim
65 words
A high power semiconductor device which includes all the features as defined in claim 1 and wherein the plastic encapsulation for the semiconductive element on said one surface of said strip does not extend beyond the plane of the opposite surface of said strip, opposite end portions of the strip protrude beyond the enclosure, and said end portions have means for mounting said semiconductor device.
Claim 4
Dependent Claim
53 words
The semiconductor device as defined in claim 2 wherein the means for inhibiting bending of the strip and enhancing adhesion of the plastic encapsulation to said strip includes edge and central sections of said strip at an acute angle to the plane of said strip, and said plastic encapsulation extends under said sections.
Claim 5
Dependent Claim
32 words
A semiconductor device which includes all the features as defined in claim 1 and includes the additional feature wherein the terminal member has means for enhancing its adhesion to the plastic encapsulation.
Claim 6
Dependent Claim
249 words
A power transistor assembly comprising a flat metal strip having a main portion and a wider end portion of a given length, a pair of mutually parallel elongated metal terminal members laterally adjacent to and parallel the length of said main strip portion, said metal strip and said terminal members being strips of the same metal and thickness, each of said terminal members having a length about equal to that of said strip main portion and a width about equal to one-half the difference in width between the wider end porTion of said strip and said main portion, a first part of each terminal member out of the plane of said strip, a second part of each terminal member in a common plane with said strip, an intermediate part of each terminal member bent about an axis transverse the terminal members and said strip, a semiconductor element on a central surface region of said strip main portion between the first parts of said terminal members, a filamentary wire lead interconnecting said semiconductive element and each of said first terminal member parts, means on said strip main portion for inhibiting bending of said central surface region, means on said strip for enhancing adhesion of encapsulating plastic to said strip, plastic encapsulation enveloping only said first terminal member parts, said semiconductor element, said filamentary leads and said central surface region, leaving exposed the opposite surface of said strip, the ends of said strip and the second part of each terminal member.
Claim 7
Dependent Claim
249 words
A power transistor assembly comprising a flat metal strip having a main portion and a wider end portion of a given length, a pair of mutually parallel elongated metal terminal members laterally adjacent to and parallel the length of said main strip portion, said metal strip and said terminal members being strips of the same metal and thickness, each of said terminal members having a length about equal to that of said strip main portion and a width about equal to one-half the difference in width between the wider end porTion of said strip and said main portion, a first part of each terminal member out of the plane of said strip, a second part of each terminal member in a common plane with said strip, an intermediate part of each terminal member bent about an axis transverse the terminal members and said strip, a semiconductor element on a central surface region of said strip main portion between the first parts of said terminal members, a filamentary wire lead interconnecting said semiconductive element and each of said first terminal member parts, means on said strip main portion for inhibiting bending of said central surface region, means on said strip for enhancing adhesion of encapsulating plastic to said strip, plastic encapsulation enveloping only said first terminal member parts, said semiconductor element, said filamentary leads and said central surface region, leaving exposed the opposite surface of said strip, the ends of said strip and the second part of each terminal member.
Claim 8
Dependent Claim
67 words
A high power transistor assembly having all the features as defined in claim 5 and in which the plastic encapsulation does not extend from one surface of the strip beyond the plane of the opposite surface of said strip, longitudinally opposite end portions of the strip protrude beyond the plastic encapsulation, and said end portions have means for mounting said semiconductor device to a thermal transfer means.
Claim 9
Dependent Claim
57 words
The high power transistor assembly as defined in claim 6 wherein the means for inhibiting bending of the strip and enhancing adhesion of the plastic encapsulation to the strip includes edge and central sections of the strip at an acute angle to the element attachment surface of the strip, and said plastic encapsulation extends under said sections.
Claim 10
Dependent Claim
37 words
The transistor assembly as defined in claim 7 wherein the terminal members have means for enhancing adhesion to the plastic encapsulation, a non-rigid plastic composition isolates the wire filaments and semiconductive transistor element from the plastic encapsulation.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-25 | 1976-01-24 | 1976-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-25 | 1980-01-24 | 1980-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-25 | 1984-01-24 | 1984-07-25 | $7700.00 | Window Closed / Lapsed |