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US3679439A Expired / Lapsed US ⏱️ 0.0 years remaining

Lead-containing metallizations

Assignee: EIDP Inc
•
Filing: 1971-03-23
•
Granted: 1972-07-25
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Expires: 1991-03-23
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Abstract

Abstract METALLIZING COMPOSITIONS, FOR PRODUCING FIRED-ON COATINGS WHICH HAVE GOOD ELECTRICAL PROPERTIES, COMPRISING NOBLE METALS, AN INORGANIC BINDER AND 1-25% BY WEIGHT OF LEAD. THE METALLIC LEAD IS ADDED TO THE METALLIZING COMPOSITION TO PROVIDE A FIRED METALLIZATION THAT HAS SOLDER WETABILITY AND INCREASED SOLDER LEACH RESISTANCE. THE METALLIZING COMPOSITION ARE USED TO FORM ELECTRODES, MICROCIRCUITRY AND OTHER RELATED ARTICLES IN THE ELECTRONIC INDUSTRY.

Inventors

  • 👤 Alvin A Milgram

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 23:04
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/14; H01B1/16; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-07-25 1976-01-24 1976-07-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-07-25 1980-01-24 1980-07-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-07-25 1984-01-24 1984-07-25 $7700.00 Window Closed / Lapsed

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