US3676742A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Means including a spark gap for protecting an integrated circuit from electrical discharge
Assignee: Signetics Corp
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Filing: 1971-05-24
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Granted: 1972-07-11
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Expires: 1991-05-24
Abstract
Abstract An integrated circuit chip has one or more semiconductor devices and one or more bonding pads on the chip. The one or more bonding pads are electrically coupled to the semiconductor devices. A conductor which is adapted to be connected to a reference potential is also disposed on the integrated circuit chip. The conductor has a portion of its periphery in proximity to the portion of the periphery of a bonding pad and cooperates therewith to form a spark gap for protecting the semiconductor devices against electrical discharges. The proximate portions of the peripheries of the bonding pad and the conductor can be rectilinear or formed in tooth-like projections.
Inventors
- 👤 Lewis K Russell
- 👤 James L Banks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 20:35
CPC Classifications
H; H03; H03F; H03F1/00; H03F1/52; H01; H01T; H01T4/00; H01T4/08; H10; H10D; H10D89/00; H10D89/60; H10D99/00; H10W; H10W42/00; H10W42/60; H10W74/00
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
109 words
In an integrated circuit chip of the type having one or more semiconductor devices formed therein, input protection means for protecting the one or more semiconductor devices against electrical discharge comprising at least one bonding pad formed on the integrated circuit chip, coupling means connecting said at least one bonding pad to one of the semiconductor devices, a conductor which is adapted to be connected to a reference potential and which is disposed on the integrated circuit chip, said conductor having a portion of its periphery in proximity to a portion of the periphery of said at least one bonding pad and cooperating therewith to form a spark gap.
Claim 2
Dependent Claim
109 words
In an integrated circuit chip of the type having one or more semiconductor devices formed therein, input protection means for protecting the one or more semiconductor devices against electrical discharge comprising at least one bonding pad formed on the integrated circuit chip, coupling means connecting said at least one bonding pad to one of the semiconductor devices, a conductor which is adapted to be connected to a reference potential and which is disposed on the integrated circuit chip, said conductor having a portion of its periphery in proximity to a portion of the periphery of said at least one bonding pad and cooperating therewith to form a spark gap.
Claim 3
Dependent Claim
33 words
Input protection means in accordance with claim 1 in which said bonding pad comprises metallization and in which said proximate portions of the peripheries of said bonding pad and said conductor are rectilinear.
Claim 4
Dependent Claim
65 words
Input protection means in accordance with claim 1 in which said bonding pad and said conductor comprise metallization and in which said proximate portions of the peripheries of said bonding pad and said conductor each have one or more tooth-like projections tapering to a point, the points on said bonding pad periphery being generally aligned with but spaced from the points on said conductor periphery.
Claim 5
Dependent Claim
36 words
Input protection means in accordance with claim 1 including a layer of glass formed on the semiconductor chip and functioning to provide an ionization path for facilitating electrical discharge between said bonding pad and said conductor.
Claim 6
Dependent Claim
41 words
Input protection means in accordance with claim 1 including an airtight enclosure for the integrated circuit chip, said enclosure being filled with a gas functioning to provide an ionization path for facilitating electrical discharge between said bonding pad and said conductor.
Claim 7
Dependent Claim
35 words
Input protection means in accordance with claim 1 in which said coupling means includes a charge slow-down resistor formed in the integrated circuit chip for limiting current surges to the one or more semiconductor devices.
Claim 8
Dependent Claim
49 words
Input protection means in accordance with claim 1 in which said coupling means includes a current conducting device having a relatively high voltage threshold connected between the one or more semiconductor devices and reference potential for cooperating with the spark gap to provide a discharge path for electrical surges.
Claim 9
Dependent Claim
20 words
Input protection means in accordance with claim 7 in which said current conducting device comprises a thick field MOS gate.
Claim 10
Dependent Claim
36 words
Input protection means in accordance with claim 3 including a layer of glass formed on the semiconductor chip and functioning to provide an ionization path for facilitating electrical discharge between said bonding pad and said conductor.
Claim 11
Dependent Claim
41 words
Input protection means in accordance with claim 3 including an airtight enclosure for the integrated circuit chip, said enclosure being filled with a gas functioning to provide an ionization path for facilitating electrical discharge between said bonding pad and said conductor.
Claim 12
Dependent Claim
72 words
Input protection means in accordance with claim 3 in which said coupling means includes a charge slow-down resistor formed in the integrated circuit chip for limiting current surges to the one or more semiconductor devices and includes a current conducting device having a relatively high voltage threshold connected between the one or more semiconductor devices and reference potential for cooperating with the spark gap to provide a discharge path for electrical surges.
Claim 13
Dependent Claim
20 words
Input protection mEans in accordance with claim 11 in which said current conducting device comprises a thick field MOS gate.
References Cited (Backward Citations)
US3413497A
Cited
US3597640A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-11 | 1976-01-10 | 1976-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-11 | 1980-01-10 | 1980-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-11 | 1984-01-10 | 1984-07-11 | $7700.00 | Window Closed / Lapsed |