Abstract Fine particles of organic resins derived from vinylidene chloride such as Saran F-220 resin, a copolymer of vinylidene chloride and acrylonitrile, densely codeposit with copper when dispersed in aqueous acidic copper electroplating baths. These fine particles of polyvinylidene resins codeposit on vertical cathodes to an amazingly high volume percent compared to any other bath-insoluble particles, inorganic or organic. The surfaces of such two-phase copper coatings with their densely imbedded resin particles have anti-seizing properties. Furthermore, when subsequent thin plate is deposited over these copper surfaces with their densely imbedded particles, a finely porous over-lay plate is obtained. Also the resin particles may be dissolved out with solvents to yield porous copper surfaces or porous films.
A method in accordance with claim 1 wherein said organic resin particles are copolymers of vinylidene chloride and acrylonitrile.
Claim 2
Dependent Claim
19 words
A method in accordance with claim 1 wherein said acid copper electroplating bath is an acidic copper sulfate bath.
Claim 3
Dependent Claim
19 words
A method in accordance with claim 1 wherein said acid copper electroplating bath is an acidic copper fluoborate bath.
Claim 4
Dependent Claim
34 words
A method in accordance with claim 1 wherein said resin particles are less than about 50 microns size and present dispersed in the plating bath in concentrations of at least 1 gram per liter.
Claim 5
Dependent Claim
22 words
A method in accordance with claim 1 wherein said acidic copper electroplating baths are operated at bath temperatures below about 140* F.
Claim 6
Dependent Claim
32 words
An electroplating bath comprising an aqueous acidic copper electroplating bath containing dispersed therein fine organic resin particles, selected from the class consisting of polymers of vinylidene chloride, and copolymers of vinylidene chloride.
Claim 7
Dependent Claim
19 words
A bath in accordance with claim 7 wherein said organic resin particles are copolymers of vinylidene chloride and acrylonitrile.
Claim 8
Dependent Claim
19 words
A bath in accordance with claim 7 wherein said acid copper electroplating bath is an acidic copper sulfate bath.
Claim 9
Dependent Claim
19 words
A bath in accordance with claim 7 wherein said acid copper electroplating bath is an acidic copper fluoborate bath.
Claim 10
Dependent Claim
34 words
A bath in accordance with claim 7 wherein said resin particles are less than about 50 microns size and present dispersed in the plating bath in concentrations of at least 1 gram per liter.
Claim 11
Dependent Claim
13 words
The method of claim 1 wherein the pH ranges from 0.3 to 1.5.