US3673016A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of dividing a semiconductor wafer
Assignee: Telefunken Electronic GmbH
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Filing: 1969-12-01
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Granted: 1972-06-27
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Expires: 1989-12-01
Abstract
Abstract A METHOD OF DIVIDING A SEMICONDUCTOR WAFER HAVING A PLURALITY OF COMPONENETS OR CIRCUITS AT ONE FACE OF THE WAFER COMPRISING PARTIALLY SAWING THE WAFER FROM THE OPPOSITE FACE OF THE WAFER ALONG LINES FOR THE DIVISION OF THE WAFER INTO INDIVIDUAL COMPONENTS OR CIRCUITS SO THAT ALONG THESE LINES THE THICKNESS OF THE WAFER IS REDUCED IN COMPARISION TO THE REMAINDER OF THE WAFER, AND ETCHING THE SAWN FACE OF THE WAFER WITHOUT THE USE OF A MASK TO COMPLETE THE DIVISION. THE METHOD IS PARTICULARLY SUITABLE FOR USE WITH WAFERS, HAVING THICK SELF SUPPORTING CONDUCTING PATHS WHICH EXTEND OVER THE SURFACE OF THE WAFER AND ARE CONNECTED TO THE ELECTRODES OF THE COMPONENTS OR CIRCUITS.
Inventors
- 👤 Dieter Gerstner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 22:05
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/60; H10P50/64; H10P50/642; H10P52/00; H10W; H10W20/00; H10W20/40; Y; Y10; Y10S; Y10S148/00; Y10S148/028; Y10S257/00; Y10S257/926
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-06-27 | 1975-12-27 | 1976-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-06-27 | 1979-12-27 | 1980-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-06-27 | 1983-12-27 | 1984-06-27 | $7700.00 | Window Closed / Lapsed |