US3670208A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic package, buss strip and printed circuit base assembly
Assignee: TECH-ETCH Inc A CORP OF
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Filing: 1970-07-13
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Granted: 1972-06-13
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Expires: 1990-07-13
Abstract
Abstract A space-saving assembly including a printed circuit card with aligned sets of wire lead mounting terminals such as holes therethrough arranged in modularly spaced parallel rows, a strip including ground and voltage supply busses separated by insulation, located on the card between the holes of each of the aligned sets with a wire lead from each strip extending into respective diagonally opposite holes of each set, and Dual-InLine Packages (DIP) located over the buss strip with the package wire leads extending into the respective holes of the respective set to be soldered to respective printed leads on the card, with the buss strip under the DIPs acting as the heat sink for the DIPs. An alternative embodiment of the buss strip has one of the conductive busses formed in a U-shaped section providing buss elements above and below the other buss thereby shielding the latter. A second alternative embodiment of the buss strip has three busses with three respective leads for each set of holes to provide ground and voltage at two different potentials to each DIP.
Inventors
- 👤 Vram E Hovnanian
- 👤 Edward Kitzmiller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:38
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; H01; H01R; H01R12/00; H01R12/70; H01R12/7076; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10272; H05K2201/10431; H05K2201/10507; H05K2201/10515; H05K2201/10613; H05K2201/10621; H05K2201/10689
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
126 words
A microelectronic package, buss strip and printed circuit base assembly comprising: a base of dielectric material having a plurality of apertured terminals, and printed leads connected thereto each adapted to receive a wire lead for use in making an electrical circuit; a multi-conductor buss strip with wire leads extending downwardly therefrom, said strip being located on the base with said leads projecting through and in electrical contact with selected terminals herein referred to as power terminals for supplying electrical power at electrically different potentials to the selected terminals; and a microelectronic package having a plurality of wire leads extending downwardly therefrom, said package being located over the buss strip and with its leads projecting through and in electrical contact with selected terminals including said power terminals.
Claim 2
Dependent Claim
126 words
A microelectronic package, buss strip and printed circuit base assembly comprising: a base of dielectric material having a plurality of apertured terminals, and printed leads connected thereto each adapted to receive a wire lead for use in making an electrical circuit; a multi-conductor buss strip with wire leads extending downwardly therefrom, said strip being located on the base with said leads projecting through and in electrical contact with selected terminals herein referred to as power terminals for supplying electrical power at electrically different potentials to the selected terminals; and a microelectronic package having a plurality of wire leads extending downwardly therefrom, said package being located over the buss strip and with its leads projecting through and in electrical contact with selected terminals including said power terminals.
Claim 3
Dependent Claim
111 words
In an electrical assembly including a base of dielectric material provided with a plurality of apertured terminals and printed leads connected thereto, each terminal being adapted to receive a wire lead for use in making an electrical circuit, and a microelectronic package having a plurality of wire leads extending downwardly therefrom for insertion into and electrical contact with selected terminals, the improvement comprising the provision of: a multi-conductor buss strip, the conductors thereof having wire leads extending downwardly therefrom for insertion into and electrical contact with certain of the selected terminals for supplying thereto electrical power at electrically different potentials, said buss strip immediately overlying the base and underlying said package.
Claim 4
Dependent Claim
111 words
In an electrical assembly including a base of dielectric material provided with a plurality of apertured terminals and printed leads connected thereto, each terminal being adapted to receive a wire lead for use in making an electrical circuit, and a microelectronic package having a plurality of wire leads extending downwardly therefrom for insertion into and electrical contact with selected terminals, the improvement comprising the provision of: a multi-conductor buss strip, the conductors thereof having wire leads extending downwardly therefrom for insertion into and electrical contact with certain of the selected terminals for supplying thereto electrical power at electrically different potentials, said buss strip immediately overlying the base and underlying said package.
Claim 5
Dependent Claim
25 words
The invention as defined in claim 1 wherein each conductor of the buss strip is elongated, flat and of uniform cross-sectional area throughout its length.
Claim 6
Dependent Claim
20 words
The invention as defined in claim 2 wherein the widths of the strip and of the package are substantially equal.
Claim 7
Dependent Claim
45 words
The invention as defined in claim 2 wherein the buss strip includes a sandwich of conductors, one of said conductors including upper and lower parallel elements interconnected by a yoke element and another of said conductors being located between and spaced from the parallel elements.
Claim 8
Dependent Claim
31 words
The invention as defined in claim 2 wherein the buss strip includes a sandwich of upper, intermediate and lower conductors insulated from one another, said conductors being of different electric potential.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-06-13 | 1975-12-13 | 1976-06-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-06-13 | 1979-12-13 | 1980-06-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-06-13 | 1983-12-13 | 1984-06-13 | $7700.00 | Window Closed / Lapsed |