Apparatus for uniformly plating a continuous cylindrical substrate

Abstract

Abstract Apparatus for electroplating copper onto a wire substrate at very high speeds and continuously, and associated copper electrolytes and plating methods. An essentially hollow cylinder is provided as a plating cell through which the wire can be advanced and along which recirculated electrolytes can be passed. Recirculation inlets are provided to communicate with the central passage and are arranged to ionize the fluid uniformly and inject it into the passage so as to be distributed uniformly about the passing wire and to be directed symmetrically and radially against the wire and then diverted symmetrically and with agitation along the wire toward an exit port. Novel associated electroplating methods and electrolytes, such as copper cyanide and copper sulfate, are also described. The result is to plate copper very quickly, yet uniformly, onto the wire to provide a substrate of controlled surface configuration for subsequent plating of thin magnetic films.

Inventors

• 👤 Peter P Semienko
• 👤 Emil Toledo

Bibliographic Details