Vapor-plated cermet resistor
Abstract
Abstract A TUNGSTEN-TUNGSTEN OXIDE ELECTRICAL RESISTANCE FILM IS DEPOSITED BY PASSING A GASEOUS MIXTURE CONTAINING OXYGEN AND TUNGSTEN HEXCARBONYL VAPOR IN CONTACT WITH A SUITABLE SUBSTRATE MAINTAINED AT A TEMPERATURE SUFFICIENTLY HIGH TO DECOMPOSE THE CARBONYL VAPOR. THE SHEET RESISTANCE OF THE DEPOSITED FILM CAN BE VARIED FROM 50 OHMS PER SQUARE TO 5,000 OHMS PER SQUARE BY CONTROLLING THE MOLAR RATIO OF OXYGEN TO TUNGSTEN HEXACARBONYL, THEREBY DETERMINING THE RATIO OF TUNGSTEN TO TUNGSTEN OXIDE IN THE CERMET FILM. THE FILM IS PARTICULARLY SUITED FOR USE AS A RESISTOR IN THE FIBRICATION OF INTEGRATED CIRCUITS, AND IS COMPATIBLE WITH DIFFUSED ACTIVE COMPONET OF SEMICONDUCTOR DEVICES.
Inventors
- 👤 Warren L Brand
Bibliographic Details
Claims Analysis
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-06-13 | 1975-12-13 | 1976-06-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-06-13 | 1979-12-13 | 1980-06-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-06-13 | 1983-12-13 | 1984-06-13 | $7700.00 | Window Closed / Lapsed |