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US3666913A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of bonding a component lead to a copper etched circuit board lead

Assignee: Texas Instruments Inc
•
Filing: 1966-09-14
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Granted: 1972-05-30
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Expires: 1986-09-14
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Abstract

Abstract This invention provides a method for bonding a copper etched circuit board lead to a component lead while eliminating blow out of the copper lead by applying an oxide to the copper lead which is relatively non-conductive at temperatures below the welding temperature but decomposible at the welding temperature. Because of the insulating properties of the oxide, a larger current passes through the component lead than the copper lead, allowing the component lead to be preheated to the bonding temperature, decomposing the oxide and thereby bonding the copper lead to the preheated component lead.

Inventors

  • 👤 James F Haefling
  • 👤 Lawrence L Meyer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 16:23
CPC Classifications
B; B23; B23K; B23K11/00; B23K11/10; B23K11/11; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 4 words
reducing said oxide, and
Claim 2
Dependent Claim 33 words
causing said second current to become larger than said first current, thereby raising the temperature of said copper etched lead and effecting a bond between said component lead and said copper etched lead.

References Cited (Backward Citations)

GB814527A Cited
US3190771A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-05-30 1975-11-29 1976-05-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-05-30 1979-11-29 1980-05-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-05-30 1983-11-29 1984-05-30 $7700.00 Window Closed / Lapsed

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