Variable depth etching process
Abstract
Abstract VARIABLE DEPTH ETCHED CHANNELS ARE FORMED IN A METAL SUBSTRATE. A PATTERN IS FORMED ON THE SUBSTRATE BY STANDARD PHOTO-ETCHING TECHNIQUES, AND A FILM OF GOLD IS DEPOSITED ON THE PORTIONS OF THE METAL SUBSTRATE WHICH ARE NOT TO BE FORMED INTO CHANNELS. IN ONE EMBODIMENT A METAL OVERLAY SUCH AS NICKEL IS ELECTRODEPOSITED OVER THE ENTIRE ASSEMBLY AT A VARIABLE DEPTH. THE METAL OVERLAY IS THEN CHEMICALLY ETCHED UNTIL THE OVERLAY IS COMPLETELY REMOVED. MAXIMUM DEPTH OF THE ETCHED CHANNELS WILL BE RELATED TO THE MAXIMUM THICKNESS OF THE OVERLAY. IN ANOTHER EMBODIMENT,THE SUBSTRATE WITH THE GOLDFILM IS PUT THROUGH A DEPLATING PROCESS WHICH WILL FORM THE CHANNELS BY ELECTROREMOVAL OF SUBSTRATE MATERIAL.
Inventors
- 👤 Eugene J Szetela
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-30 | 1975-11-29 | 1976-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-30 | 1979-11-29 | 1980-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-30 | 1983-11-29 | 1984-05-30 | $7700.00 | Window Closed / Lapsed |