Method of retaining and bonding articles
Abstract
Abstract BEAM-LEAD INTEGRATED-CIRCUIT CHIPS ARE HELD IN DESIRED LOCATIONS ON SUBSTRATES THROUGH THE USE OF HIGH PURITY GLYCEROL AS AN ADHESIVE. THE BEAM LEADS OF THE CHIP ARE PRECOATED WITH GLYCEROL AND THE CHIPS ARE PLACED AT A DESIRED LOCATION. IF THE DESIRED LOCATION IS THE BE PERMANENT THE CHIP CAN BE BONDED WITH CONVENTIONAL THERMOCOMPRESSION BONDING TECHNIQUE AND THE BLYCEROL WILL BE EVAPORATED LEAVING NO UNDESIRABLE RESIDUES. THUS, THE GLYCEROL DOES NOT INTERFERE WITH THE BONDING. IF THE LOCATION IS TO BE TEMPORARY, EXTREMELY FRAGILE CHIPS CAN BE REMOVED BY LIFTING THE CHIP WITH A HEATED VACUUM PICKUP. CONTACT OF THE CHIP WITH A HEATED PICKUP EVAPORATES THE GLYCEROL AND THE CHIP COMES AWAY FROM THE SUBSTRATE QUITE READILY. LESS FRAGILE CHIPS CAN BE REMOVED WITHOUT EVAPORATION OF THE GLYCEROL.
Inventors
- 👤 William R Wanesky
Bibliographic Details
Claims Analysis
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-30 | 1975-11-29 | 1976-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-30 | 1979-11-29 | 1980-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-30 | 1983-11-29 | 1984-05-30 | $7700.00 | Window Closed / Lapsed |