US3665589A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead attachment to high temperature devices
Assignee: National Aeronautics and Space Administration
•
Filing: 1969-10-23
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Granted: 1972-05-30
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Expires: 1989-10-23
Abstract
Abstract A technique for the attachment of leads to electronic devices which permits operation of the devices over a wide temperature range. The technique contemplates the use of core conductors having a thin coating of metal thereon whereby only a limited amount of coating material is available to form an alloy which bonds the core conductor to the device electrode, the electrode composition thus being effected only in the region adjacent the lead and the bond between the electrode and device being unaffected.
Inventors
- 👤 Richard Farrell
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 01:16
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0444; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/533; H10W72/534; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/555; H10W72/59; Y; Y10; Y10S; Y10S438/00; Y10S438/931; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
132 words
A method of attaching leads to electronic circuit componEnts comprising the steps of: bonding one end of an electrode to an electronic device; fabricating a composite lead wire by forming a thin coating of precisely limited thickness of a first conductive material on a core wire of a second conductive material; mechanically positioning the lead wire against the opposite end of the electrode; subjecting the device and wire to the elevated temperature at which an eutectic including said first conductive material and the material comprising the electrode forms at the opposite end of the electrode; and cooling the device and wire whereby the limited amount of eutectic so formed will bond the wire to the opposite end of the electrode without affecting the existing bond between the electrode and the electronic device.
Claim 2
Independent Claim
132 words
A method of attaching leads to electronic circuit componEnts comprising the steps of: bonding one end of an electrode to an electronic device; fabricating a composite lead wire by forming a thin coating of precisely limited thickness of a first conductive material on a core wire of a second conductive material; mechanically positioning the lead wire against the opposite end of the electrode; subjecting the device and wire to the elevated temperature at which an eutectic including said first conductive material and the material comprising the electrode forms at the opposite end of the electrode; and cooling the device and wire whereby the limited amount of eutectic so formed will bond the wire to the opposite end of the electrode without affecting the existing bond between the electrode and the electronic device.
Claim 3
Dependent Claim
43 words
The method of claim 1 wherein the step of subjecting the electronic device and wire to an elevated temperature comprises: heating the device until a small bead of eutectic forms on the electrode and then stopping the application of heat to the device.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-30 | 1975-11-29 | 1976-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-30 | 1979-11-29 | 1980-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-30 | 1983-11-29 | 1984-05-30 | $7700.00 | Window Closed / Lapsed |