Patent JPS5237756A successfully refreshed from Google Patents.
US3665263A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Improvements in air-isolated integrated circuit devices to facilitate the connection thereof to circuit boards
Assignee: Individual
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Filing: 1970-06-05
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Granted: 1972-05-23
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Expires: 1990-06-05
Abstract
Abstract An integrated circuit device has a frame of semiconductor material and blocks of the same semiconductor material situated in a space or spaces substantially enclosed by the frame, with the blocks being spaced from the frame and having circuit elements therein which are interconnected by beam leads also functioning as the sole means mechanically coupling or locating the blocks relative to the frame. Certain of the beam leads project beyond the periphery of the frame and all of the beam leads are substantially coplanar and constitute the highest elevations on the circuit device so that the projecting beam leads can be conveniently bonded to conductive areas on a substrate, such as a circuit board, defining external circuits.
Inventors
- 👤 Katsuhiko Akiyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 03:00
CPC Classifications
H; H10; H10W; H10W10/00; H10W10/01; H10W10/021; H10W10/20; H10W20/00; H10W20/40
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
227 words
An integrated circuit device consisting of at least two members of the same semiconductor material, at least one of said members forming a frame for said device and defining at least one space which is substantially enclosed by said frame, at least another of said members being in the form of a block situated in said space and spaced from said frame, circuit elements formed in at least each said block, a continuous insulating layer covering a surface of each of said members and spanning the spacing between said frame and each said block, said insulating layer having an opening at each of said circuit elements, and conductive beam leads superposed on said insulating layer and connected with said circuit elements at said openings in the insulating layer, at least some of said beam leads spanning said spacing between said frame and each said block and constituting, with said insulating layer, the sole means by which each said block is mounted within said frame, at least some of said beam leads projecting beyond the outer periphery of said frame, said beam leads being all substantially coplanar with each other and constituting the highest elevations on the integrated circuit device from said surface of said members for convenience in bonding said beam leads which project beyond the frame to conductive areas on a substrate which define external circuits.
Claim 2
Dependent Claim
227 words
An integrated circuit device consisting of at least two members of the same semiconductor material, at least one of said members forming a frame for said device and defining at least one space which is substantially enclosed by said frame, at least another of said members being in the form of a block situated in said space and spaced from said frame, circuit elements formed in at least each said block, a continuous insulating layer covering a surface of each of said members and spanning the spacing between said frame and each said block, said insulating layer having an opening at each of said circuit elements, and conductive beam leads superposed on said insulating layer and connected with said circuit elements at said openings in the insulating layer, at least some of said beam leads spanning said spacing between said frame and each said block and constituting, with said insulating layer, the sole means by which each said block is mounted within said frame, at least some of said beam leads projecting beyond the outer periphery of said frame, said beam leads being all substantially coplanar with each other and constituting the highest elevations on the integrated circuit device from said surface of said members for convenience in bonding said beam leads which project beyond the frame to conductive areas on a substrate which define external circuits.
Claim 3
Dependent Claim
22 words
An integrated circuit device according to claim 1, in which at least one of said circuit elements is formed in said frame.
Claim 4
Dependent Claim
20 words
An integrated circuit device according to claim 1, in which a plurality of said members are in said block form.
Claim 5
Dependent Claim
19 words
An integrated circuit device according to claim 1, in which said frame is endless to completely enclose said space.
Claim 6
Dependent Claim
21 words
An integrated circuit device according to claim 1, in which said frame is U-shaped to enclose said space on three sides.
Claim 7
Dependent Claim
51 words
An integrated circuit device according to claim 1, in which said frame is H-shaped to define a space in addition to said one space, and in which a plurality of said members are in said block form with at least one member in block form being situated in each said space.
Claim 8
Dependent Claim
287 words
The combination of a substrate having conductive areas on a surface thereof to define external circuits; and at least one integrated circuit device mounted on said substrate and connected with said external circuits, said integrated circuit device consisting of at least two members of the same semiconductor material, at least one of said members forming a frame for said device and defining at least one space which is substantially enclosed by said frame, at least Another of said members being in the form of a block situated in said space and spaced from said frame, circuit elements formed in at least each said block, a continuous insulating layer covering a surface of each of said members and spanning the spacing between said frame and each said block, said insulating layer having an opening at each of said circuit elements, and conductive beam leads superposed on said insulating layer and connected with said circuit elements at said openings in the insulating layer, at least some of said beam leads spanning said spacing between said frame and each said block and constituting, with said insulating layer, the sole means by which each said block is mounted within said frame, at least some of said beam leads projecting beyond the outer periphery of said frame, said beam leads being all substantially coplanar with each other and constituting the highest elevations on the integrated circuit device from said surface of said members, said integrated circuit device being disposed against said substrate with said beam leads facing towards said surface of the substrate with said beam leads which project beyond the frame being facially contacted with, and bonded to respective portions of said conductive areas for the connection to said external circuits.
Claim 9
Dependent Claim
287 words
The combination of a substrate having conductive areas on a surface thereof to define external circuits; and at least one integrated circuit device mounted on said substrate and connected with said external circuits, said integrated circuit device consisting of at least two members of the same semiconductor material, at least one of said members forming a frame for said device and defining at least one space which is substantially enclosed by said frame, at least Another of said members being in the form of a block situated in said space and spaced from said frame, circuit elements formed in at least each said block, a continuous insulating layer covering a surface of each of said members and spanning the spacing between said frame and each said block, said insulating layer having an opening at each of said circuit elements, and conductive beam leads superposed on said insulating layer and connected with said circuit elements at said openings in the insulating layer, at least some of said beam leads spanning said spacing between said frame and each said block and constituting, with said insulating layer, the sole means by which each said block is mounted within said frame, at least some of said beam leads projecting beyond the outer periphery of said frame, said beam leads being all substantially coplanar with each other and constituting the highest elevations on the integrated circuit device from said surface of said members, said integrated circuit device being disposed against said substrate with said beam leads facing towards said surface of the substrate with said beam leads which project beyond the frame being facially contacted with, and bonded to respective portions of said conductive areas for the connection to said external circuits.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-23 | 1975-11-22 | 1976-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-23 | 1979-11-22 | 1980-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-23 | 1983-11-22 | 1984-05-23 | $7700.00 | Window Closed / Lapsed |