US3664899A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Removal of organic polymeric films from a substrate
Assignee: General Electric Co
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Filing: 1969-12-29
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Granted: 1972-05-23
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Expires: 1989-12-29
Abstract
Abstract A solvent free method for removing thin organic polymeric film from a substrate is provided utilizing ultraviolet light at wavelengths below 3,500 Angstroms. The method also can be employed to effect the direct configurational removal of organic polymeric film from etchable substrates to provide for the fabrication of microelectronic circuits.
Inventors
- 👤 Archibald N Wright
- 👤 Richard C Merrill
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 08:53
CPC Classifications
H; H10; H10P; H10P95/00; G; G03; G03F; G03F7/00; G03F7/26; G03F7/42; H10N; H10N97/00; H10P50/00; H10P50/20; H10P50/28; H10P50/286; H10P50/287
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
14 words
The method of claim 1, where the organic polymeric film is organic solvent insoluble.
Claim 2
Dependent Claim
18 words
The method of claim 1, where the organic polymeric film is removed from selected portions of the substrate.
Claim 3
Dependent Claim
16 words
The method of claim 3, where the organic polymeric film is removed in a configurational manner.
Claim 4
Dependent Claim
133 words
In a method for making a positive photoresist consisting of a composite of an etchable substrate and an organic polymeric film in contact thereto which is patterned on selected portions of the surface of the etchable substrate in a configurational manner to provide for the etching of exposed substrate surface by chemical means, the improvement of initially effecting the deposition of the organic polymeric film on the surface of the etchable substrate by the surface photopolymerization of a photopolymerizable organic material in vaporous form and thereafter effecting the complete removal of selected portions of the resulting organic polymeric from the surface of the etchable substrate with ultraviolet light at a wavelength of from about 1, 800 to 3,000 Angstroms in the presence of oxygen at a partial pressure of at least 1 torr.
Claim 5
Dependent Claim
17 words
The method of claim 1, where the removal of the organic polymeric film is effected in air.
Claim 6
Dependent Claim
14 words
The method of claim 1, where the organic polymeric film is deposited from N-phenylmaleimide.
Claim 7
Dependent Claim
14 words
The method of claim 1, where the organic polymeric film is deposited from hexachlorobutadiene.
Claim 8
Dependent Claim
13 words
The method of claim 1, where the substrate is an evaporated metal film.
Claim 9
Dependent Claim
13 words
The method of claim 1, where the substrate is silicon or oxides thereof.
Claim 10
Dependent Claim
172 words
In a method for etching a substrate involving the employment of an ultraviolet light photosensitive aliphatically unsaturated organic solvent soluble organic polymer which can be rendered insoluble when exposed to ultraviolet light involving the steps of (1) depositing said organic polymer onto the surface of the substrate, (2) exposing selected portions of the organic polymeric film to light to configurationally alter the solubility characteristics of the exposed organic polymeric film, (3) dissolving soluble portions of the organic polymeric film to produce a substrate-organic polymeric film composite having exposed substrate surface in a desired configuration, (4) etching the exposed substrate surface with a chemical etchant, and (5) removing organic polymeric film from the remaining substrate surface, which involves the improvement of effecting the complete removal of organic polymeric film in (5) by exposing the film to ultraviolet light at an intensity of at least 100 milliwatts per square centimeter and at a wavelength of from about 1,800 to 3, 000 Angstroms at about atmospheric pressure in the presence of an oxygen containing gas.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-23 | 1975-11-22 | 1976-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-23 | 1979-11-22 | 1980-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-23 | 1983-11-22 | 1984-05-23 | $7700.00 | Window Closed / Lapsed |