Controlled temperature circuit package

Claim 2

An integrally heated electronic package comprising: a. a thermally conductive component mounting board; b. an electric heating element permanently and intimately affixed on one side of said board in contiguous thermal contact therewith; and c. a plurality of discrete electrical components mounted on and distributed over the opposite side of said board in contiguous thermal contact therewith.

Claim 3

An electronic package in accordance with claim 1 characterized further in that said heating element is a film resistor.

Claim 4

An internally heated electronic package comprising in combination: a. a case; b. at least one thermally conductive component mounting board supported within said case; c. a plurality of electrical components mounted on one side of said board in contiguous thermal contact therewith; and d. a film resistor having means to receive a heating current and deposited on the opposite side of said board.

Claim 5

An internally heated electronic package comprising in combination: a. a case; b. at least one thermally conductive component mounting board supported within said case; c. a plurality of electrical components mounted on one side of said board in contiguous thermal contact therewith; and d. a film resistor having means to receive a heating current and deposited on the opposite side of said board.

Claim 6

An integrally heated electronic package in accordance with claim 1 and characterized further by an electrically conductive layer between said board and said heating element, said layer having means to connect it to a ground potential to reduce electric coupling between components through said heating element.

Claim 7

An electronic package in accordance with claim 1 and characterized further in that some of said electric components are crystals housed in flat metal cans, said cans being mounted so that at least one wall is contiguous with said board for better heat transfer and a lower profile.

Claim 8

An electronic package in accordance with claim 5 and characterized further in that said metal cans are soldered to electrical conductors on said board for better heat transfer.

Claim 9

A panel for supporting and heating a plurality of electrical components comprising: a. a thermally conductive, electrically nonconductive substrate; b. a resistive film disposed on one side of and in contiguous thermal contact with said substrate; and c. an electrically conductive layer sandwiched between said film and said substrate, said layer being provided with means to connect it to a ground potential to attenuate signal coupling between components mounted on the opposite side of said panel through said film.

Claim 10

A panel for supporting and heating a plurality of electrical components comprising: a. a thermally conductive, electrically nonconductive substrate; b. a resistive film disposed on one side of and in contiguous thermal contact with said substrate; and c. an electrically conductive layer sandwiched between said film and said substrate, said layer being provided with means to connect it to a ground potential to attenuate signal coupling between components mounted on the opposite side of said panel through said film.

Claim 11

A panel in accordance with claim 7 characterized further in that an electrically conductive film is sandwiched between said resistive film and said substrate, said conductive film having means to connect it to a ground potential to prevent signal coupling between electrical components mounted on said board through said heating element.

Claim 12

An internally heated filter package comprising: a. a container; b. a thermally conducting component mounting board within said container; c. a plurality of components electrically interconnected to form a filter, said components including crystals in metal cans, mounted on one side of said board in thermal contact therewith; d. a film resistor having means to receive a heating current and extending along the opposite side of said board in thermal contact therewith; and e. an electrically conductive layer sandwiched between said board and said film resistor, and having means to connect it to a ground potential so as to attenuate signal coupling between said components through said film resistor.

Claim 13

An internally heated filter package comprising: a. a container; b. a thermally conducting component mounting board within said container; c. a plurality of components electrically interconnected to form a filter, said components including crystals in metal cans, mounted on one side of said board in thermal contact therewith; d. a film resistor having means to receive a heating current and extending along the opposite side of said board in thermal contact therewith; and e. an electrically conductive layer sandwiched between said board and said film resistor, and having means to connect it to a ground potential so as to attenuate signal coupling between said components through said film resistor.