US3662086A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package
Assignee: National Beryllia Corp
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Filing: 1970-05-25
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Granted: 1972-05-09
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Expires: 1990-05-25
Abstract
Abstract A ceramic disk for sealing the chamber built onto a metal stud acting as a heat sink, is provided with a surface that will be the interior surface when sealed, which acts as the substrate for the semiconductor or electronic circuit. The circuit on said disk can be completed and tested before it is sealed onto the stud.
Inventors
- 👤 Philip S Hessinger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:19
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
97 words
A semiconductor package combination consisting essentially of an electrically insulating disk and a heat conducting metal stud said stud having a head which includes an annular flange adapted to form a cup shaped chamber with the head, said disk being shaped to fit snugly within the upper portion of said annular flange and having a semiconductor circuit formed on the underside thereof, said disk being sealed within said annular flange so that said circuit is held out of contact with the stud, and means connecting the circuit on the underside of said disk to the outside thereof.
Claim 2
Dependent Claim
97 words
A semiconductor package combination consisting essentially of an electrically insulating disk and a heat conducting metal stud said stud having a head which includes an annular flange adapted to form a cup shaped chamber with the head, said disk being shaped to fit snugly within the upper portion of said annular flange and having a semiconductor circuit formed on the underside thereof, said disk being sealed within said annular flange so that said circuit is held out of contact with the stud, and means connecting the circuit on the underside of said disk to the outside thereof.
Claim 3
Dependent Claim
22 words
The semiconductor package as claimed in claim 1 wherein said annular flange is formed as an integral part of the metal stud.
Claim 4
Dependent Claim
22 words
The semiconductor package as claimed in claim 1 wherein said annular flange includes an internal shoulder adapted to position the disk therein.
Claim 5
Dependent Claim
15 words
The semiconductor as claimed in claim 1 wherein said disk consists essentially of beryllium oxide.
Claim 6
Dependent Claim
153 words
A process of making a semiconductor package combination of the type which includes a semiconductor and circuit therefor formed on an electrically Insulating disk sealed within a chamber formed on a metal, heat-sink stud, the steps comprising providing a stud having a head from which projects an annular flange forming a cup-like chamber with the head, providing an electrically insulating ceramic disk containing at least one hole extending from the top to the bottom surface thereof and with a rim adapted to fit snugly within the top portion of the flange of said stud, forming a semiconductor circuit on the bottom surface of said disk, brazing at least one conductor element in said hole and connecting said conductor to said semiconductor circuit, testing said circuit, and thereafter sealing said disk in the top portion of said annular flange whereby the bottom surface thereof and the semiconductor circuit is sealed within said cup-like chamber.
Claim 7
Dependent Claim
153 words
A process of making a semiconductor package combination of the type which includes a semiconductor and circuit therefor formed on an electrically Insulating disk sealed within a chamber formed on a metal, heat-sink stud, the steps comprising providing a stud having a head from which projects an annular flange forming a cup-like chamber with the head, providing an electrically insulating ceramic disk containing at least one hole extending from the top to the bottom surface thereof and with a rim adapted to fit snugly within the top portion of the flange of said stud, forming a semiconductor circuit on the bottom surface of said disk, brazing at least one conductor element in said hole and connecting said conductor to said semiconductor circuit, testing said circuit, and thereafter sealing said disk in the top portion of said annular flange whereby the bottom surface thereof and the semiconductor circuit is sealed within said cup-like chamber.
References Cited (Backward Citations)
FR1468888A
Cited
US3361868A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-09 | 1975-11-08 | 1976-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-09 | 1979-11-08 | 1980-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-09 | 1983-11-08 | 1984-05-09 | $7700.00 | Window Closed / Lapsed |