Method for photodepositing smaller size image screen areas for cathode ray tube from larger size mask apertures

Claim 2

The method defined in claim 2 wherein said shaping step is carried out after step (c).

Claim 3

The method defined in claim 1 including the additional step between steps (c) and (d) comprising g. removing said etch-resistant material while retaining said replicas in said apertures.

Claim 4

The method defined in claim 1 wherein step (e) includes removing said etch-resistant material.

Claim 5

In a method of producing a color kinescope having an image screen and an apertured color selection mask including a plurality of final-size apertures, wherein said image screen is produced with the use of said mask having the apertures temporarily reduced in size, said method comprising the steps of: a. providing an electrically conductive substrate having two opposed major surfaces and a perforated catalytic layer of an electroless deposition-initiating material disposed at one of said surfaces, said substrate including said plurality of final-size apertures extending between said surfaces, said perforations in said catalytic layer, being smaller than said apertures such that portions of said catalytic layer partially overhang said apertures; b. electrolessly depositing a light-opaque material within said apertures over those portions of said catalytic layer that overhang said apertures whereby to produce replicas of said overhanging portions of said catalytic layer, said replicas being adhered to the walls of the apertures, c. photodepositing said image screen by projecting light through said replicas; d. removing said replicas from said mask; and e. incorporating said mask and said screen into said kinescope.

Claim 6

The method as recited in claim 1 wherein said light opaque material is selected from the group consisting essentially of nickel; copper; cobalt, nickel-phosphorous alloys; nickel-boron alloys; and alloys of at least two of nickel, copper, and cobalt.

Claim 7

In a method of producing a color kinescope having an image screen and a color selection mask containing apertures of final-size, wherein said image screen is produced with the use of said mask having said apertures temporarily reduced in size, said method comprising the steps of: a. providing an electrically conductive substrate having two substantially parallel major surfaces, b. providing at one of said surfaces a continuous catalytic layer of an electroless deposition-initiating material, c. providing a perforated etch-resistant layer on said catalytic layer, the perforations in said etch-resistant layer having a predetermined size smaller than said final size of said apertures, d. providing said final-size apertures in said substrate, said apertures extending between said major surfaces and being in substantial register with respective ones of said perforations, said apertures being larger than said perforations so that coextensive portions of said etch-resistant layer and portions of said catalytic layer overhang respective ones of said apertures; e. electrolessly depositing light opaque material at least at said overhanging portions of said catalytic layer to produce a replica of said overhanging portions; f. photodepositing said image screen by projecting light through said replicas; g. removing said light opaque material, said catalytic layer and said etch-resistant layer from said mask; and h. incorporating said mask and said screen into said kinescope.