US3661316A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Aiming device for semiconductor bonding apparatus
Assignee: Kulicke and Soffa Industries Inc
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Filing: 1970-04-13
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Granted: 1972-05-09
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Expires: 1990-04-13
Abstract
Abstract Apparatus for aiming a tool used to perform a mechanical operation on a semiconductor device, including a light pencil which directs a thin beam of light in the area where the tool is to be aimed. The position of the light beam indicates one of the positions of the moveable tool.
Inventors
- 👤 Frederick W Kulicke Jr
- 👤 John J Lepone
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 23:30
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/0711; H10W72/07141; H10W72/07521; H10W72/50; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
190 words
A means for aiming a tool used to perform a mechanical operation on a semiconductor device comprising: a tool moveable to one of at least two different positions one of which is for performing an operation on said device; a projecting means for projecting a thin directed beam of light said beam being sufficiently thin so as to project a spot of light onto the surface of said semiconductor device, said spot being of less area than the area of said surface of said device; supporting means supporting said projecting means, said supporting means being in a fixed predetermined physical relationship with a first of said two different positions of said tool so that the position on said semiconductor device hit by said directed light beam is determinative of the location on said surface of said device of said first position of said tool irrespective of whether said tool itself is in said first position whereby the location of said projected spot within the area of said surface of said device determines the point of contact of said tool on said surface when said tool moves to said first position.
Claim 2
Dependent Claim
190 words
A means for aiming a tool used to perform a mechanical operation on a semiconductor device comprising: a tool moveable to one of at least two different positions one of which is for performing an operation on said device; a projecting means for projecting a thin directed beam of light said beam being sufficiently thin so as to project a spot of light onto the surface of said semiconductor device, said spot being of less area than the area of said surface of said device; supporting means supporting said projecting means, said supporting means being in a fixed predetermined physical relationship with a first of said two different positions of said tool so that the position on said semiconductor device hit by said directed light beam is determinative of the location on said surface of said device of said first position of said tool irrespective of whether said tool itself is in said first position whereby the location of said projected spot within the area of said surface of said device determines the point of contact of said tool on said surface when said tool moves to said first position.
Claim 3
Dependent Claim
20 words
The apparatus of claim 1 further characterized by said tool and said projecting means being rigidly connected and moveable together.
Claim 4
Dependent Claim
38 words
The apparatus of claim 1 further characterized by said beam being fixed in a single location and the addition of a moveable platform holding a plurality of semiconductor devices, said beam being aimed at one of said platform.
Claim 5
Dependent Claim
27 words
The apparatus of claim 1 further characterized by said beam being fixed in a single location and supported by a microscope employed to observe the mechanical operation.
Claim 6
Dependent Claim
162 words
Apparatus for rapidly engaging a bonding tool with a predetermined point on a semiconductor device comprising: a base for supporting a semiconductor device; a bonding tool supported on said base for vertical movement relative to the semiconductor device; a light source supported by said base having means for producing a directed pin point light beam said beam being sufficiently thin so as to project a spot of light onto the surface of said semiconductor device, said spot being of less area than the area of said surface of said device; means for directing the pin point light beam onto a predetermined point on the semiconductor device; and means connected to said base for moving the bonding tool into contact with said semiconductor device at said predetermined point whereby the location of said projected spot within the area of said surface of said device determines the point of contact of said tool on said surface when said tool moves to said first position.
Claim 7
Dependent Claim
162 words
Apparatus for rapidly engaging a bonding tool with a predetermined point on a semiconductor device comprising: a base for supporting a semiconductor device; a bonding tool supported on said base for vertical movement relative to the semiconductor device; a light source supported by said base having means for producing a directed pin point light beam said beam being sufficiently thin so as to project a spot of light onto the surface of said semiconductor device, said spot being of less area than the area of said surface of said device; means for directing the pin point light beam onto a predetermined point on the semiconductor device; and means connected to said base for moving the bonding tool into contact with said semiconductor device at said predetermined point whereby the location of said projected spot within the area of said surface of said device determines the point of contact of said tool on said surface when said tool moves to said first position.
Claim 8
Dependent Claim
21 words
Apparatus as set forth in claim 5, which further includes means for moving said semiconductor device relative to said bonding tool.
Claim 9
Dependent Claim
21 words
Apparatus as set forth in claim 6 which further includes means for moving said bonding tool relative to said semiconductor device.
Claim 10
Dependent Claim
24 words
Apparatus as set forth in claim 7 which further includes means fixedly connecting said light source to said means for moving said bonding tool.
Claim 11
Dependent Claim
37 words
Apparatus as set forth in claim 7 wherein said bonding tool is moveable horizontally relative to said light source and which further includes means supporting said semiconductor device on said base moveable relative to said light source.
References Cited (Backward Citations)
US3050617A
Cited
US3388848A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-05-09 | 1975-11-08 | 1976-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-05-09 | 1979-11-08 | 1980-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-05-09 | 1983-11-08 | 1984-05-09 | $7700.00 | Window Closed / Lapsed |