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US3660732A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor structure with dielectric and air isolation and method

Assignee: Signetics Corp
•
Filing: 1971-02-08
•
Granted: 1972-05-02
•
Expires: 1991-02-08
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Abstract

Abstract Semiconductor structure having devices formed in a very thin layer of monocrystalline silicon with the devices being dielectrically and air isolated from each other.

Inventors

  • 👤 David Frank Allison

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 21:27
CPC Classifications
H; H10; H10D; H10D99/00; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10W; H10W10/00; H10W10/01; H10W10/061; H10W10/10; H10W10/181; H10W10/021; H10W10/20; Y; Y10; Y10S; Y10S148/00; Y10S148/051; Y10S148/053; Y10S148/085; Y10S148/096; Y10S148/122

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 168 words
In a semiconductor structure, a support body, a layer of insulating material formed on the support body and having a relatively planar surface, a body of semiconductor material formed on the layer of insulating material and having a relatively precisely controlled predetermined depth ranging from approximately 2 to 5 1/2 microns with a surface generally parallel to the surface of the layer of insulating material, and at least a pair of semiconductor devices formed in the body of semiconductor material by diffused regions forming junctions extending to said surface of said semiconductor body, said body of semiconductor material having grooves formed therein to expose the layer of insulating material to the air so that the devices are isolated from each other by the air in the grooves and by the layer of insulating material, said grooves opening through said surface of said semiconductor body and having a width at said surface of said semiconductor body which is at least as great as the width at the insulating layer.
Claim 2
Dependent Claim 168 words
In a semiconductor structure, a support body, a layer of insulating material formed on the support body and having a relatively planar surface, a body of semiconductor material formed on the layer of insulating material and having a relatively precisely controlled predetermined depth ranging from approximately 2 to 5 1/2 microns with a surface generally parallel to the surface of the layer of insulating material, and at least a pair of semiconductor devices formed in the body of semiconductor material by diffused regions forming junctions extending to said surface of said semiconductor body, said body of semiconductor material having grooves formed therein to expose the layer of insulating material to the air so that the devices are isolated from each other by the air in the grooves and by the layer of insulating material, said grooves opening through said surface of said semiconductor body and having a width at said surface of said semiconductor body which is at least as great as the width at the insulating layer.
Claim 3
Dependent Claim 19 words
A semiconductor structure as in claim 1 together with metallization carried by the semiconductor body for interconnecting said devices.
Claim 4
Dependent Claim 26 words
A semiconductor structure as in claim 1 wherein all of said diffused regions extend completely through said semiconductor body down to said layer of insulating material.
Claim 5
Dependent Claim 40 words
A semiconductor structure as in claim 1 wherein said devices are formed by each having spaced diffused source and drain regions extending downwardly through the semiconductor body to the layer of insulating material with a gate disposed between the same.
Claim 6
Dependent Claim 16 words
A semiconductor as in claim 1 wherein at least one of said devices is a diode.
Claim 7
Dependent Claim 18 words
A semiconductor structure as in claim 1 wherein at least one of said devices is a lateral transistor.
Claim 8
Dependent Claim 18 words
A semiconductor structure as in claim 1 wherein at least one of said devices is a bipolar transistor.

References Cited (Backward Citations)

US3411051A Cited
US3423255A Cited
US3466741A Cited
US3461360A Cited
US3475664A Cited
US3412295A Cited
US3423651A Cited
US3486892A Cited
US3489961A Cited
US3445925A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-05-02 1975-11-01 1976-05-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-05-02 1979-11-01 1980-05-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-05-02 1983-11-01 1984-05-02 $7700.00 Window Closed / Lapsed

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