US3657508A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of and radiant energy transmissive member for reflow soldering
Assignee: AT&T Inc
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Filing: 1970-11-18
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Granted: 1972-04-18
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Expires: 1990-11-18
Abstract
Abstract A radiant energy transmissive member, such as of quartz, is formed with a plurality of peculiarly contoured grooves therein to accommodate, align and facilitate the simultaneous reflow soldering of a plurality of wires or leads to aligned and preferably solder-coated elements, such as circuit path extremities on a printed circuit board. Each groove is contoured such that the solder confined therein, when heated to a molten state, will be drawn at least in part by capillary attraction over the top of the associated wire or lead, with the solder merging on either side with the adjacent element so as to form a reliable fillet-shaped reflow solder connection. Also, by masking one surface of the quartz member so as to be selectively opaque, the radiant energy can be directed more precisely in accordance with a resultant transparent pattern only specific areas to be heated.
Inventors
- 👤 William R Studnick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 12:05
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3494; B; B23; B23K; B23K1/00; B23K1/005; B23K1/0053; B23K2101/00; B23K2101/36; B23K2101/42; H05K2203/00; H05K2203/30; H05K2203/304
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
251 words
For use in a reflow bonding system for permanently joining adjacent portions of at least first and second elements supported on a common base: a heat transmissive member having at least one groove formed in one surface thereof to confine initially at least a part of at least the first element portion to be bonded, said groove being dimensioned and contoured so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space relative to at least the first element portion during the formation of a reflow bonded connection, said space being sufficient to allow a layer of bonding material capable of acquiring a flowable state when subjected to heat, when predeposited initially in an area relative to the adjacent portions of the first and second elements so as also to be confirmed within said groove, to be drawn at least in part by capillary attraction, upon being heated through said member to a flowable state, through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of the second element as to produce a reliable reflow bonded connection between the first and second elements, and Means for generating and directing concentrated radiant energy through said transmissive member to heat the bonding material confined within said groove to a flowable state in the area of the first and second portions to thereby produce a reflow bonded connection therebetween.
Claim 2
Dependent Claim
251 words
For use in a reflow bonding system for permanently joining adjacent portions of at least first and second elements supported on a common base: a heat transmissive member having at least one groove formed in one surface thereof to confine initially at least a part of at least the first element portion to be bonded, said groove being dimensioned and contoured so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space relative to at least the first element portion during the formation of a reflow bonded connection, said space being sufficient to allow a layer of bonding material capable of acquiring a flowable state when subjected to heat, when predeposited initially in an area relative to the adjacent portions of the first and second elements so as also to be confirmed within said groove, to be drawn at least in part by capillary attraction, upon being heated through said member to a flowable state, through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of the second element as to produce a reliable reflow bonded connection between the first and second elements, and Means for generating and directing concentrated radiant energy through said transmissive member to heat the bonding material confined within said groove to a flowable state in the area of the first and second portions to thereby produce a reflow bonded connection therebetween.
Claim 3
Dependent Claim
233 words
In a radiant energy reflow soldering system for making solder connections between adjacent portions of at least first and second mating elements: a radiant energy transmissive member exhibiting a thermal conductivity sufficient to also function as a heat sink, said member having at least one longitudinally extending groove formed and dimensioned in one surface thereof to confine initially at least a part of at least the first element portion to be reflow soldered, said groove subsequently allowing the establishment of a space which varies between the wall area thereof and the first element portion during the formation of a reflow solder connection, said space being sufficient to allow a layer of solder, when pre-deposited initially in an area relative to the adjacent portions of the first and second elements so as also to be confined within said groove, to be drawn at least in part by capillary attraction, upon being heated to a molten state, through said established space, around the periphery of the first element portion, and merging on either side thereof with the adjacent portion of the second element so as to produce a reliable reflow solder connection therebetween, and means for generating and directing radiant energy through said transmissive member to heat the solder confined within said groove to a molten state in the area of the first and second element portions to thereby produce a reflow solder connection therebetween.
Claim 4
Dependent Claim
233 words
In a radiant energy reflow soldering system for making solder connections between adjacent portions of at least first and second mating elements: a radiant energy transmissive member exhibiting a thermal conductivity sufficient to also function as a heat sink, said member having at least one longitudinally extending groove formed and dimensioned in one surface thereof to confine initially at least a part of at least the first element portion to be reflow soldered, said groove subsequently allowing the establishment of a space which varies between the wall area thereof and the first element portion during the formation of a reflow solder connection, said space being sufficient to allow a layer of solder, when pre-deposited initially in an area relative to the adjacent portions of the first and second elements so as also to be confined within said groove, to be drawn at least in part by capillary attraction, upon being heated to a molten state, through said established space, around the periphery of the first element portion, and merging on either side thereof with the adjacent portion of the second element so as to produce a reliable reflow solder connection therebetween, and means for generating and directing radiant energy through said transmissive member to heat the solder confined within said groove to a molten state in the area of the first and second element portions to thereby produce a reflow solder connection therebetween.
Claim 5
Dependent Claim
102 words
In a reflow soldering system in accordance with claim 2, said radiant energy transmissive member having a plurality of spaced grooves formed therein for aligning and confining a plurality of said first elements to be reflow soldered simultaneously with a plurality of respectively aligned second elements, and said member further exerting a force against said first elements in the direction of said adjacent second elements at least until the solder, pre-deposited relative to the first and second elements, has been heated to a molten state, said grooves thereafter confining both said first and second elements until coMpletion of a reflow solder connection.
Claim 6
Dependent Claim
52 words
In a reflow soldering system in accordance with claim 3, said radiant energy transmissive member being composed of quartz, and said grooves being contoured and dimensioned to accommodate said first elements when in the form of wire leads and said second elements when in the form of terminals of an electrical circuit.
Claim 7
Dependent Claim
47 words
In a reflow soldering system in accordance with claim 2, said transmissive member further having masked areas selectively formed on at least one surface thereof which are opaque to radiant energy, said unmasked areas thereby defining a precise transparent pattern through which the radiant energy is transmitted.
Claim 8
Dependent Claim
81 words
In a reflow soldering system in accordance with claim 2, said groove in said member being contoured to have an outer region of substantially rectangular cross section and an inner, communicating central region which is dome-shaped in cross section, said groove being dimensioned such that the wall defining said dome-shaped region initially contacts the first element portion to be reflow soldered, and said rectangular region subsequently accommodates an aligned second element portion prior to the completion of a reflow solder operation.
Claim 9
Dependent Claim
80 words
In a reflow soldering system in accordance with claim 2, said groove in said member being contoured to have an outer region substantially rectangular cross section and an inner, communicating central region which is V-shaped in cross section, said groove being dimensioned such that the walls defining said V-shaped region initially contact the first element portion to be reflow soldered, and said rectangular region subsequently accommodates an aligned second element portion prior to the completion of a reflow solder operation.
Claim 10
Dependent Claim
83 words
In a reflow soldering system in accordance with claim 2, said groove in said member being contoured to have an outer region of substantially rectangular cross section and an inner, communicating central region which is trapezoidal in cross section, said groove being dimensioned such that at least two walls defining said trapezoidal region initially contact the first element portion to be reflow soldered, and said rectangular region subsequently accommodating an aligned second element portion prior to the completion of a reflow solder operation.
Claim 11
Dependent Claim
54 words
In a reflow soldering system in accordance with claim 6, said radiant energy transmissive member being composed of quartz, and further having masked areas selectively formed on at least one surface thereof which are opaque to radiant energy, said unmasked areas thereby defining a precise transparent pattern through which the radiant energy is transmitted.
Claim 12
Dependent Claim
54 words
In a reflow soldering system in accordance with claim 7, said radiant energy transmissive member being composed of quartz, and further having masked areas selectively formed on at least one surface thereof which are opaque to radiant energy, said unmasked areas thereby defining a precise transparent pattern through which the radiant energy is transmitted.
Claim 13
Dependent Claim
54 words
In a reflow soldering system in accordance with claim 8, said radiant energy transmissive member being composed of quartz, and further having selective masked areas formed on at least one surface thereof which are opaque to radiant energy, said unmasked areas thereby defining a precise transparent pattern through which the radiant energy is transmitted.
Claim 14
Independent Claim
214 words
A method of producing a reflow bonded connection between adjacent portions of at least first and second elements, comprising the steps of: forming at lest one groove in one surface of a heat transmissive member to confine at least a part of at least the first element portion to be reflow bonded, said groove being contoured and dimensioned so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space relative to at least the first element portion during the formation of a reflow bonded connection; pre-depositIng a layer of bonding material in an area relative to the adjacent portions of the first and second elements so as to be confined within said groove, said bonding material being capable of acquiring a flowable state when subjected to heat, and transmitting concentrated heat through said transmissive member so as to impinge upon and heat said bonding material to a flowable state sufficient to cause said bonding material to be drawn at least in part by capillary attraction through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of said second element so as to produce a reliable reflow bonded connection therebetween.
Claim 15
Independent Claim
214 words
A method of producing a reflow bonded connection between adjacent portions of at least first and second elements, comprising the steps of: forming at lest one groove in one surface of a heat transmissive member to confine at least a part of at least the first element portion to be reflow bonded, said groove being contoured and dimensioned so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space relative to at least the first element portion during the formation of a reflow bonded connection; pre-depositIng a layer of bonding material in an area relative to the adjacent portions of the first and second elements so as to be confined within said groove, said bonding material being capable of acquiring a flowable state when subjected to heat, and transmitting concentrated heat through said transmissive member so as to impinge upon and heat said bonding material to a flowable state sufficient to cause said bonding material to be drawn at least in part by capillary attraction through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of said second element so as to produce a reliable reflow bonded connection therebetween.
Claim 16
Independent Claim
238 words
A method of producing a reflow bonded connection between adjacent portions of at least first and second elements, comprising the steps of: pre-coating the portion to be reflow bonded of at least one of said first and second elements with a bonding material capable of acquiring a flowable state when subjected to heat; confining at least a part of the first element portion to be bonded within a groove formed in a heat transmissive member, said groove being dimensioned and contoured so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space between the confined portion of the first element and the adjacent wall area defining the groove during the formation of a reflow solder connection, and transmitting concentrated heat through said transmissive member so as to impinge upon and heat said bonding material to a flowable state, while force is simultaneously exerted against said first element in the direction of said second element for at least a portion of the time during which heat is applied thereto, the combination of said heat and force resulting in said bonding material being drawn at least in part by capillary attraction through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of the second element so as to produce a reliable reflow bonded connection therebetween.
Claim 17
Independent Claim
238 words
A method of producing a reflow bonded connection between adjacent portions of at least first and second elements, comprising the steps of: pre-coating the portion to be reflow bonded of at least one of said first and second elements with a bonding material capable of acquiring a flowable state when subjected to heat; confining at least a part of the first element portion to be bonded within a groove formed in a heat transmissive member, said groove being dimensioned and contoured so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space between the confined portion of the first element and the adjacent wall area defining the groove during the formation of a reflow solder connection, and transmitting concentrated heat through said transmissive member so as to impinge upon and heat said bonding material to a flowable state, while force is simultaneously exerted against said first element in the direction of said second element for at least a portion of the time during which heat is applied thereto, the combination of said heat and force resulting in said bonding material being drawn at least in part by capillary attraction through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of the second element so as to produce a reliable reflow bonded connection therebetween.
Claim 18
Independent Claim
275 words
A method of producing a reflow soldered connection between adjacent portions of at least first and second elements, comprising the steps of: forming at least one longitudinally extending groove in one surface of a radiant energy transmissive member exhibiting a thermal conductivity sufficient to also function as a heat sink, said groove being contoured and dimensioned so as to align, confine and initially have wall contact with at least a part of at least said first element to be reflow soldered, and to subsequently allow a space to be established between at least the first element portion and the adjacent wall area of said groove, said space being variable during a period starting with the solder reaching a molten state and ending when the solder re-solidifies to form a reflow solder connection; pre-depositing a layer of solder in an area relative to the adjacent portions of the first and second elements so as to be confined within said groove, and transmitting radiant energy through said transmissive member so as to impinge upon and heat said solder confined within said groove to a molten state, while force is simultaneously exerted against said first element in the direction of said second element for at least a portion of the time during which heat is applied thereto, the combination of said heat and force causing said solder to be drawn at least in part by capillary attraction through said established space, around the periphery of said first element portion, and merging on either side thereof with the adjacent portion of said second element so as to produce a reliable reflow solder connection between said first and second elements.
Claim 19
Independent Claim
275 words
A method of producing a reflow soldered connection between adjacent portions of at least first and second elements, comprising the steps of: forming at least one longitudinally extending groove in one surface of a radiant energy transmissive member exhibiting a thermal conductivity sufficient to also function as a heat sink, said groove being contoured and dimensioned so as to align, confine and initially have wall contact with at least a part of at least said first element to be reflow soldered, and to subsequently allow a space to be established between at least the first element portion and the adjacent wall area of said groove, said space being variable during a period starting with the solder reaching a molten state and ending when the solder re-solidifies to form a reflow solder connection; pre-depositing a layer of solder in an area relative to the adjacent portions of the first and second elements so as to be confined within said groove, and transmitting radiant energy through said transmissive member so as to impinge upon and heat said solder confined within said groove to a molten state, while force is simultaneously exerted against said first element in the direction of said second element for at least a portion of the time during which heat is applied thereto, the combination of said heat and force causing said solder to be drawn at least in part by capillary attraction through said established space, around the periphery of said first element portion, and merging on either side thereof with the adjacent portion of said second element so as to produce a reliable reflow solder connection between said first and second elements.
Claim 20
Dependent Claim
42 words
A method in accordance with claim 14 wherein said radiant energy transmissive member is formed with a plurality of said grooves so as to accommodate and effect the simultaneous, mulTiple reflow soldering of a plurality of sets of first and second elements.
Claim 21
Dependent Claim
49 words
A method in accordance with claim 14 wherein said radiant energy transmissive member has selective masked areas formed on at least one surface thereof which are opaque to radiant energy, said unmasked areas thereby defining a precise transparent pattern through which the radiant energy is transmitted through said member.
Claim 22
Independent Claim
221 words
A method of producing a reflow solder connection between adjacent portions of at least first and second elements, comprising the steps of: solder coating the portion to be reflow soldered of at least one of said first and second elements; confining at least a part of the first element portion to be reflow soldered within a groove formed in a radiant energy transmissive member, said groove being dimensioned and contoured so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space between the first element portion and the adjacent wall area of the groove during the formation of a reflow solder connection, and transmitting radiant energy through said transmissive member so as to impinge upon and heat the solder pre-coated on at least one of the first and second elements to a molten state, while force is exerted by said member against said first element in the direction of said second element, the combination of said heat and force resulting in said solder being drawn at least in part by capillary attraction through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of the second element so as to effect a reliable reflow soldered connection therebetween.
Claim 23
Independent Claim
221 words
A method of producing a reflow solder connection between adjacent portions of at least first and second elements, comprising the steps of: solder coating the portion to be reflow soldered of at least one of said first and second elements; confining at least a part of the first element portion to be reflow soldered within a groove formed in a radiant energy transmissive member, said groove being dimensioned and contoured so as to provide a wall area which initially contacts the first element portion, and which subsequently, at least in part, allows the establishment of a space between the first element portion and the adjacent wall area of the groove during the formation of a reflow solder connection, and transmitting radiant energy through said transmissive member so as to impinge upon and heat the solder pre-coated on at least one of the first and second elements to a molten state, while force is exerted by said member against said first element in the direction of said second element, the combination of said heat and force resulting in said solder being drawn at least in part by capillary attraction through said established space, over the first element portion, and merging on either side thereof with the adjacent portion of the second element so as to effect a reliable reflow soldered connection therebetween.
Claim 24
Independent Claim
297 words
A method of producing multiple reflow solder connections between adjacent portions of at least first and second elements which together form one of a plurality of sets of elements, comprising the steps of: solder coating the portion to be reflow soldered of at least one of said first and second elements of each set; forming a plurality of longitudinally extending grooves in one surface of a radiant energy transmissive member exhibiting a thermal conductivity sufficient to also function as a heat sink, each of said grooves being positioned, contoured and dimensioned so as to align, confine and initially have wall contact with at least a part of at least the portion of the associated first element to be reflow soldered, and to subsequently allow a space to be established between at least the first element portion and the adjacent wall area of the associated groove during the formation of a reflow solder connection therein, and transmitting radiant energy through said transmissive member so as to impinge upon and heat said solder confined within each groove to a molten state, while force is exerted against all of said first elements in the direction of said respectively adjacent second elements for at least a portion of the time during which heat is applied thereto, the combination of said heat and force causing said solder associated with each set of first and second elements to be drawn at least in part by capillary attraction through said established space of the associated groove, around the periphery of the first element portion confined therewithin, and merging on either side thereof with the adjacent portion of said second element so as to produce a reliable reflow solder connection between said first and second element of each set in each of said grooves simultaneously.
Claim 25
Independent Claim
297 words
A method of producing multiple reflow solder connections between adjacent portions of at least first and second elements which together form one of a plurality of sets of elements, comprising the steps of: solder coating the portion to be reflow soldered of at least one of said first and second elements of each set; forming a plurality of longitudinally extending grooves in one surface of a radiant energy transmissive member exhibiting a thermal conductivity sufficient to also function as a heat sink, each of said grooves being positioned, contoured and dimensioned so as to align, confine and initially have wall contact with at least a part of at least the portion of the associated first element to be reflow soldered, and to subsequently allow a space to be established between at least the first element portion and the adjacent wall area of the associated groove during the formation of a reflow solder connection therein, and transmitting radiant energy through said transmissive member so as to impinge upon and heat said solder confined within each groove to a molten state, while force is exerted against all of said first elements in the direction of said respectively adjacent second elements for at least a portion of the time during which heat is applied thereto, the combination of said heat and force causing said solder associated with each set of first and second elements to be drawn at least in part by capillary attraction through said established space of the associated groove, around the periphery of the first element portion confined therewithin, and merging on either side thereof with the adjacent portion of said second element so as to produce a reliable reflow solder connection between said first and second element of each set in each of said grooves simultaneously.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-04-18 | 1975-10-18 | 1976-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-04-18 | 1979-10-18 | 1980-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-04-18 | 1983-10-18 | 1984-04-18 | $7700.00 | Window Closed / Lapsed |