Process for depositing organic coatings
Abstract
Abstract A PROCESS FOR DEPOSITING ORGANIC COATINGS UPON METALLIC OR OTHER CONDUCTIVE SUBSTRATES WHEREIN THE ORGANIC SUBSTANCE IS A DISPERSION OF INCOMPLETELY, PARTIALLY OR COMPLETELY POLYMERIZED MATERIAL IN AN AQUEOUS ELECTROLYTE. THE SUBSTRATE IS CONNECTED AS AN ANODE OR A CATHODE IN THE DISPERSION AND JUXTAPOSED WITH A COUNTERELECTRODE. AN ELECTRICAL POTENTIAL IS APPLIED AND THE CONDUCTIVITY OF THE DISPERSION IS INITIALLY ESTABLISHED AT 5,000-100,000 UMHO-CM.-1 AT 20*C. THE DISPERSION INCLUDES ONE OR MORE ORGANIC SUBSTANCES WHICH DEPOSIT UPON THE SUBSTRATE UNDER THE INFLUENCE OF THE ELECTRICAL POTENTIAL SUCH THAT WITHIN 25 SECONDS AFTER THE CURRENT-DENSITY PEAK DEVELOPS, THE ELECTRICAL RESISTANCE AT THE DEPOSITION-RECEIVING ELECTRODE INCREASES TO REDUCE THE CURRENT DENSITY TO A LEVEL BELOW 20% OF THE PEAK THEREOF. PREFERABLY, THE CURRENT DENSITY IS REDUCED BELOW 20% OF ITS PEAK LEVEL WITHIN 10 SECONDS AFTER THE CURRENT DENSITY PEAKS.
Inventors
- 👤 Jurgen Weigel
Bibliographic Details
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1975-02-28 | 1975-08-30 | 1976-02-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-02-28 | 1979-08-30 | 1980-02-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-02-28 | 1983-08-30 | 1984-02-29 | $7700.00 | Window Closed / Lapsed |