US3644797A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor assembly including aperture-mounted diaphragm-supported wafer
Assignee: Westinghouse Brake English Electric Semi Conductors Ltd
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Filing: 1970-04-21
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Granted: 1972-02-22
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Expires: 1990-04-21
Abstract
Abstract A semiconductor assembly including a insulating planar body having a semiconductor wafer mounted in aperture extending between the major faces thereof. A pair of electrically and heatconducting diaphragms hermetically sealed to the body close off the ends of aperture and support the wafer therewithin, the body itself extending beyond the peripheries of the diaphragms to prevent surface tracking. A conductor, including a first, tongue portion which extends into the aperture and a second portion, provides electrical contact with an inner region of the wafer. A pair of such assemblies is formed by mounting a second wafer in a second aperture in the body, and utilizing the second portion of the conductor of each assembly as one of the diaphragms of the other assembly.
Inventors
- 👤 Victor J Carter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 05:23
CPC Classifications
H; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
220 words
A semiconductor assembly comprising a planar body fabricated of an electrically insulating material and including first and second opposed major faces, and an aperture extending through said body between said major faces, a semiconductor wafer located in said aperture and having first and second opposed major faces, a first diaphragm fabricated of electrically conducting and heatconducting material, hermetically sealed to the first major face of said planar body to close the end of the aperture in that face, the side of said diaphragm facing inwardly toward said aperture being in unsecured electrically conducting engagement with the first major face of said wafer, a flanged member hermetically secured to the second major face of the said planar body and encircling the end of the aperture extending through said second face of said body, a second diaphragm hermetically secured along the periphery thereof to a flange of said flanged member, said second diaphragm being in unsecured electrically conducting engagement with the second major face of said wafer, said planar body extending outwardly beyond the peripheries of said first and second diaphragms to prevent surface tracking thereacross and said assembly enabling, in operation, adequate electrically conducting and heat-conducting connection between the faces of said wafer and said first and second diaphragms to be effected through the application of a force across the diaphragms.
Claim 2
Dependent Claim
220 words
A semiconductor assembly comprising a planar body fabricated of an electrically insulating material and including first and second opposed major faces, and an aperture extending through said body between said major faces, a semiconductor wafer located in said aperture and having first and second opposed major faces, a first diaphragm fabricated of electrically conducting and heatconducting material, hermetically sealed to the first major face of said planar body to close the end of the aperture in that face, the side of said diaphragm facing inwardly toward said aperture being in unsecured electrically conducting engagement with the first major face of said wafer, a flanged member hermetically secured to the second major face of the said planar body and encircling the end of the aperture extending through said second face of said body, a second diaphragm hermetically secured along the periphery thereof to a flange of said flanged member, said second diaphragm being in unsecured electrically conducting engagement with the second major face of said wafer, said planar body extending outwardly beyond the peripheries of said first and second diaphragms to prevent surface tracking thereacross and said assembly enabling, in operation, adequate electrically conducting and heat-conducting connection between the faces of said wafer and said first and second diaphragms to be effected through the application of a force across the diaphragms.
Claim 3
Dependent Claim
80 words
An assembly as claimed in claim 1, wherein there is interposed between the flanged member and the body a conductor having a first tonguelike portion projecting inwardly of the aperture to lie between the second diaphragm and said second major face of the wafer and providing electrical connection between said second major face of the wafer and the second diaphragm, and a second portion projecting outwardly of the assembly thereby to provide an external electrical connection to the first portion.
Claim 4
Dependent Claim
98 words
An assembly as claimed in claim 2, wherein the wafer has therein three regions of different conductivity type separated one from the other by a respective PN-junction, one of which regions extends inwardly of the element from said one of the opposed major faces thereof and the other two of which regions both extend inwardly of the wafer from said other of the opposed major faces with a first of said two regions encircling the second of said two regions, the first portion of the conductor engaging only said first of said other two regions of the element.
Claim 5
Dependent Claim
34 words
An assembly as claimed in claim 3, wherein the first portion of the conductor has therethrough an aperture through which extends an electrical connection to the second of said two regions of the wafer.
Claim 6
Dependent Claim
23 words
An assembly as claimed in claim 4, wherein the second diaphragm also has therethrough an aperture through which also extends the electrical connection.
Claim 7
Dependent Claim
61 words
An assembly as claimed in claim 4, wherein a tubular-shaped spacer is provided which encircles the aperture of the second diaphragm, one end of the tubular-shaped spacer being hermetically sealed to the second diaphragm and the other end being hermetically closed by a connector between which and the second of said two other regions of the wafer extends the electrical connection.
Claim 8
Dependent Claim
81 words
A devices as claimed in claim 6, wherein the electrical connection is resiliently compressible, effective electrical contact then being capable of being made between the first diaphragm and said one of the opposed major faces of the wafer, said first portion of the conductor and the first of said two regions of the wafer, and said electrical connection and said second of the two regions of the wafer, by the application of the force across the connector and the first diaphragm.
Claim 9
Dependent Claim
14 words
An assembly as claimed in claim 1 wherein the body includes a peripheral flange.
Claim 10
Dependent Claim
32 words
An assembly as claimed in claim 2 in combination with a further said assembly, wherein the second portion of the conductor of each assembly constitutes the first diaphragm of the other assembly.
Claim 11
Dependent Claim
78 words
An assembly as claimed in claim 2 wherein said planar body includes a further said aperture, a further said semiconductor wafer being mounted in said aperture and said assembly further including a further said first diaphragm, a further said flange member, a further said second diaphragm, and a further said conductor, the second portion of the said further conductor constituting the first-mentioned first diaphragm and the second portion of the first-mentioned conductor constituting the further said first diaphragm.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-02-21 | 1975-08-23 | 1976-02-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-02-21 | 1979-08-23 | 1980-02-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-02-21 | 1983-08-23 | 1984-02-22 | $7700.00 | Window Closed / Lapsed |