US3636619A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip chip integrated circuit and method therefor
Assignee: Teledyne Inc
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Filing: 1969-06-19
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Granted: 1972-01-25
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Expires: 1989-06-19
Abstract
Abstract A flip chip integrated circuit having a raised contact pad for coupling to a substrate containing a printed circuit to which several chips are to be coupled. The raised contact pad is formed by etching a window in an active semiconductive region, depositing an aluminum mesa on the oxide passivating surface of a chip, and then evaporating an aluminum layer between the window and on top of the contact pad.
Inventors
- 👤 Joseph M Welty
- 👤 Philip Shiota
- 👤 Roger W Murray
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 22:53
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-01-24 | 1975-07-26 | 1976-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-01-24 | 1979-07-26 | 1980-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-01-24 | 1983-07-26 | 1984-01-25 | $7700.00 | Window Closed / Lapsed |