US3636419A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pressure-biased semiconductor component free from damage to semiconductor body
Assignee: Siemens AG
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Filing: 1969-09-10
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Granted: 1972-01-18
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Expires: 1989-09-10
Abstract
Abstract A wafer-shaped semiconductor body is sandwiched between contact electrodes. A foil of ductile metal bears against each contact electrode. The foils are congruent and have contours which are substantially coincidental and which are substantially in overlapping alignment. A contact member bears against each foil and is urged against each surface of the semiconductor via the corresponding foil and the corresponding contact electrode to form glidable pressure contacts.
Inventors
- 👤 Kurt Raithel
- 👤 Rene Rosenheinrich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 20:17
CPC Classifications
H; H10; H10W; H10W72/00; Y; Y10; Y10S; Y10S257/00; Y10S257/926
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
179 words
A semiconductor component having a housing, a wafer-shaped semiconductor body in the housing having substantially planar spaced surfaces on opposite sides thereof each having at least one contact electrode, a pair of terminal contact members each having a contact surface positioned on opposite sides of the semiconductor body, a pair of metal foils one of which is positioned between one of the contact electrodes and the contact surface of one of the terminal contact members, said terminal contact members, said contact electrodes and said metal foils being positioned in coaxial relation with each other and being pressed against each other under pressure only, said foils comprising a ductile metal of the group consisting of aluminum, silver, an alloy of aluminum and silver, cadmium, indium, lead and an alloy of at least one of cadmium, indium and lead, each of the foils bearing directly against a corresponding one of the contact electrodes, the foils on both sides of the semiconductor body coinciding and the semiconductor body and the terminal contact members having a radius greater than that of the foils.
Claim 2
Dependent Claim
179 words
A semiconductor component having a housing, a wafer-shaped semiconductor body in the housing having substantially planar spaced surfaces on opposite sides thereof each having at least one contact electrode, a pair of terminal contact members each having a contact surface positioned on opposite sides of the semiconductor body, a pair of metal foils one of which is positioned between one of the contact electrodes and the contact surface of one of the terminal contact members, said terminal contact members, said contact electrodes and said metal foils being positioned in coaxial relation with each other and being pressed against each other under pressure only, said foils comprising a ductile metal of the group consisting of aluminum, silver, an alloy of aluminum and silver, cadmium, indium, lead and an alloy of at least one of cadmium, indium and lead, each of the foils bearing directly against a corresponding one of the contact electrodes, the foils on both sides of the semiconductor body coinciding and the semiconductor body and the terminal contact members having a radius greater than that of the foils.
Claim 3
Dependent Claim
37 words
A semiconductor component as claimed in claim 1, wherein at least one of the foils has a surface facing the semiconductor body which has a radius smaller than that of the surface facing the terminal contact member.
Claim 4
Dependent Claim
256 words
A semiconductor component having a housing, a wafer-shaped semiconductor body in the housing having substantially planar spaced surfaces on opposite sides thereof each having at least one contact electrode, a pair of terminal contact members each having a contact surface positioned on opposite sides of the semiconductor body, a pair of metal foils one of which is positioned between one of the contact electrodes and the contact surface of one of the terminal contact members, said terminal contact members, said contact electrodes and said metal foils being positioned in coaxial relation with each other and being pressed against each other under pressure only, said foils comprising a ductile metal of the group consisting of aluminum, silver, an alloy of aluminum and silver, cadmium, indium, lead and an alloy of at least one of cadmium, indium, and lead, each of the foils bearing directly against a corresponding one of the contact electrodes, the portion of the foil contacting the contact electrode on one side of the semiconductor body coinciding with the contact surface of the terminal contact member on the other side of the semiconductor body, the semiconductor body having a radius greater than that of the foils, the foil on the other side of the semiconductor body having a radius at least as great as that of the foil on the one side of the semiconductor body, and at least one of the foils having a surface facing the semiconductor body which has a radius smaller than that of the surface facing the terminal contact member.
Claim 5
Dependent Claim
256 words
A semiconductor component having a housing, a wafer-shaped semiconductor body in the housing having substantially planar spaced surfaces on opposite sides thereof each having at least one contact electrode, a pair of terminal contact members each having a contact surface positioned on opposite sides of the semiconductor body, a pair of metal foils one of which is positioned between one of the contact electrodes and the contact surface of one of the terminal contact members, said terminal contact members, said contact electrodes and said metal foils being positioned in coaxial relation with each other and being pressed against each other under pressure only, said foils comprising a ductile metal of the group consisting of aluminum, silver, an alloy of aluminum and silver, cadmium, indium, lead and an alloy of at least one of cadmium, indium, and lead, each of the foils bearing directly against a corresponding one of the contact electrodes, the portion of the foil contacting the contact electrode on one side of the semiconductor body coinciding with the contact surface of the terminal contact member on the other side of the semiconductor body, the semiconductor body having a radius greater than that of the foils, the foil on the other side of the semiconductor body having a radius at least as great as that of the foil on the one side of the semiconductor body, and at least one of the foils having a surface facing the semiconductor body which has a radius smaller than that of the surface facing the terminal contact member.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-01-17 | 1975-07-19 | 1976-01-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-01-17 | 1979-07-19 | 1980-01-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-01-17 | 1983-07-19 | 1984-01-18 | $7700.00 | Window Closed / Lapsed |