Patent US4394801A successfully refreshed from Google Patents.
US3636418A
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Epitaxial semiconductor device having adherent bonding pads
Assignee: RCA Corp
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Filing: 1969-08-06
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Granted: 1972-01-18
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Expires: 1989-08-06
Abstract
Abstract A substrate of a dielectric material, e.g., sapphire, has a matrix of semiconductor components, e.g., diodes on a surface thereof. The components comprise a layer of a semiconductor material, e.g., silicon, including various doped regions. Connector strips are provided on the substrate for interconnecting the various components in rows and columns, and for connecting the components to bonding pads on the substrate. The bonding pads comprise a layer of the semiconductor material in direct contact with the substrate, and a layer of metal on top of the silicon layer. A layer of insulating material is optionally included between the semiconductors and metal layers.
Inventors
- 👤 Joseph Richard Burns
- 👤 Joseph Hurlong Scott
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 22:41
CPC Classifications
H; H10; H10D; H10D86/00; H10W; H10W72/00; H10W72/90; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5366; H10W72/541; H10W72/5445; H10W72/59; H10W72/931; H10W72/932; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S148/00; Y10S148/085; Y10S148/15
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
23 words
A semiconductor device as in claim 1 wherein said connector means comprises a strip of metal integral with said bonding pad metal layer.
Claim 2
Dependent Claim
19 words
A semiconductor device as in claim 1 wherein said substrate is of sapphire, spinel, beryllium oxide, or zirconium oxide.
Claim 3
Dependent Claim
23 words
A semiconductor device as in claim 2 wherein said substrate is of sapphire, said metal is aluminum, and said semiconductor material is silicon.
Claim 4
Dependent Claim
29 words
A semiconductor device as in claim 1 wherein said semiconductor material is silicon, and said pad includes a fourth layer of silicon oxide intermediate said third and second layers.
Claim 5
Dependent Claim
23 words
A semiconductor device as in claim 5 wherein said connector means comprises a strip of metal integral with said bonding pad metal layer.
Claim 6
Dependent Claim
19 words
A semiconductor device as in claim 5 wherein said substrate is of sapphire, spinel, beryllium oxide or zirconium oxide.
Claim 7
Dependent Claim
18 words
A semiconductor device as in claim 6 wherein said substrate is of sapphire and said metal is aluminum.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-01-17 | 1975-07-19 | 1976-01-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-01-17 | 1979-07-19 | 1980-01-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-01-17 | 1983-07-19 | 1984-01-18 | $7700.00 | Window Closed / Lapsed |