US3634205A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of plating a uniform copper layer on an apertured printed circuit board
Assignee: Bunker Ramo Corp
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Filing: 1968-09-27
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Granted: 1972-01-11
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Expires: 1988-09-27
Abstract
Abstract A high-speed electrolytic copper plating bath containing an aqueous solution of copper fluoborate and fluoboric acid, and optionally, an alkali metal fluoride and a surface active agent is disclosed. With this bath, a smooth and ductile copper layer can be substantially evenly deposited onto the surfaces of an apertured object such as a printed circuit board.
Inventors
- 👤 Manlio B Melillo
- 👤 Daniel P Vlachos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 07:16
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38; Y; Y10; Y10S; Y10S205/00; Y10S205/92
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
21 words
A method according to claim 1 in which said bath is at room temperature and is agitated by bubbling air therethrough.
Claim 2
Dependent Claim
59 words
A method according to claim 1 in which the ratio of said anode to said cathode is from about 1:1 to about 2:1 and said current density is from about 10 amps per square foot to about 150 amps per square foot of cathode area and the ratio of solution volume to cathode area is at least about 5:1.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-01-10 | 1975-07-12 | 1976-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-01-10 | 1979-07-12 | 1980-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-01-10 | 1983-07-12 | 1984-01-11 | $7700.00 | Window Closed / Lapsed |